Comparative analysis of microchannel heat sink configurations subject to a pressure constraint

Heat Transfer Engineering

Volumn 30, Issue 1-2, 2009, Pages 43-53

  Farnam, Dylan ^a   Sammakia, Bahgat ^a   Ackler, Harold ^a   Ghose, Kanad ^a  

^a State University of New York   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; DROPS; FLUID MECHANICS; HEAT SINKS; HEAT STORAGE; HEATING EQUIPMENT; MICROPROCESSOR CHIPS; PRESSURE DROP; QUENCHING; STRESSES; VORTEX FLOW;

CHIP-LEVEL; COMPARATIVE ANALYSIS; COOLING CAPABILITY; COOLING CHANNELS; COOLING METHODS; ENERGY SOURCING; HEAT TRANSFER SURFACE AREA; LAMINAR REGIMES; LEAKAGE LOSSES; MICRO-CHANNEL HEAT SINKS; MICRO-FLOWS; OPERATING TEMPERATURES; POWER DISSIPATIONS; RELIABILITY PROBLEMS; TOTAL PRESSURE DROP;

MICROCHANNELS;

EID: 52949108761     PISSN: 01457632     EISSN: 15210537     Source Type: Journal    
DOI: 10.1080/01457630802293324     Document Type: Conference Paper

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