Optimization of microchannel heat sinks using entropy generation minimization method

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 2, 2009, Pages 243-251

  Khan, Waqar Ahmed ^a   Culham, J Richard ^b   Yovanovich, M Michael ^b  

^a NATIONAL UNIVERSITY OF SCIENCES AND TECHNOLOGY   (Pakistan)

^b UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Analytical model; Entropy generation minimization; Microchannel heat sinks; Optimization

Indexed keywords

ACCOMMODATION COEFFICIENTS; ANALYTICAL MODEL; CHARACTERISTIC LENGTH; COMBINED EFFECT; CONTROL VOLUMES; DESIGN VARIABLES; ENTROPY BALANCE; ENTROPY GENERATION MINIMIZATION; ENTROPY GENERATION RATE; FIN SPACING; FRICTION COEFFICIENTS; GENERAL EXPRESSION; HEAT SINK MATERIALS; HYDRAULIC DIAMETER; KNUDSEN NUMBERS; MICROCHANNEL HEAT SINKS; PARAMETRIC STUDY; SLIP FLOW; THERMAL RESISTANCE;

ASPECT RATIO; COMPUTER SIMULATION; ENTROPY; FRICTION; HEAT RESISTANCE; MICROCHANNELS; OPTIMIZATION; PRESSURE DROP;

HEAT SINKS;

EID: 68349148031     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2022586     Document Type: Article

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