Electrothermal modelling and characterisation of submicron through-silicon carbon nanotube bundle vias for three-dimensional ICs

Micro and Nano Letters

Volumn 9, Issue 2, 2014, Pages 123-126

  Zhao, Wen Sheng ^a   Sun, Lingling ^a   Yin, Wen Yan ^b   Guo, Yong Xin ^c  

^a HANGZHOU DIANZI UNIVERSITY   (China)

^b ZHEJIANG UNIVERSITY   (China)

^c NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

MULTIWALLED CARBON NANOTUBES (MWCN); SINGLE-WALLED CARBON NANOTUBES (SWCN);

CARBON NANOTUBE BUNDLE; ELECTROTHERMAL MODELLING; ENERGY DELAY PRODUCT; EQUIVALENT CIRCUIT MODEL; EQUIVALENT THERMAL CONDUCTIVITIES; METAL OXIDE SEMICONDUCTOR; SINGLE-WALLED CARBON NANOTUBE BUNDLE; THREE-DIMENSIONAL ICS;

SILICON;

CARBON NANOTUBE; METAL; METAL OXIDE; MULTI WALLED NANOTUBE; SILICON; SINGLE WALLED NANOTUBE;

ARTICLE; CHEMICAL ANALYSIS; ENERGY; MODEL; RELIABILITY; TEMPERATURE SENSITIVITY; THERMAL CONDUCTIVITY;

EID: 84896959520     PISSN: None     EISSN: 17500443     Source Type: Journal    
DOI: 10.1049/mnl.2013.0553     Document Type: Article

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