Performance analysis of single-walled carbon nanotube bundle interconnects for three-dimensional integration applications

Micro and Nano Letters

Volumn 8, Issue 1, 2013, Pages 56-58

  Qian, Libo ^a   Zhu, Zhangming ^a   Ding, Ruixue ^a   Yang, Yintang ^a  

^a XIDIAN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON NANOTUBE BUNDLE; EQUIVALENT CIRCUIT MODEL; INTERCONNECT LEVELS; PERFORMANCE ANALYSIS; SINGLE-WALLED CARBON NANOTUBE BUNDLE; SINGLEWALLED CARBON NANOTUBE (SWCNT); TECHNOLOGY SCALING; THREE DIMENSIONAL INTEGRATION;

WIRE;

SINGLE-WALLED CARBON NANOTUBES (SWCN);

COPPER; SILICON; SINGLE WALLED NANOTUBE;

ARTICLE; CHEMICAL STRUCTURE; ELECTRIC CONDUCTIVITY; ELECTRICAL EQUIPMENT; MATHEMATICAL ANALYSIS;

EID: 84877859405     PISSN: None     EISSN: 17500443     Source Type: Journal    
DOI: 10.1049/mnl.2012.0856     Document Type: Article

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