Electromagnetic compatibility-oriented study on through silicon single-walled carbon nanotube bundle via (TS-SWCNTBV) arrays

IEEE Transactions on Electromagnetic Compatibility

Volumn 54, Issue 1, 2012, Pages 149-157

  Zhao, Wen Sheng ^a   Yin, Wen Yan ^a   Guo, Yong Xin ^b  

^a ZHEJIANG UNIVERSITY   (China)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Complex effective conductivity; equivalent lumped element circuit model; mutual coupling; quantum effects; through silicon single walled carbon nanotube bundle via (TS SWCNTBV) array; transient coupling noise; transmission line method (TLM)

Indexed keywords

EFFECTIVE CONDUCTIVITY; LUMPED-ELEMENT CIRCUIT MODEL; MUTUAL COUPLING; QUANTUM EFFECTS; THROUGH SILICON SINGLE-WALLED CARBON NANOTUBE BUNDLE VIA (TS-SWCNTBV) ARRAY; TRANSMISSION-LINE;

CIRCUIT THEORY; DIPOLE ANTENNAS; ELECTRIC LINES; QUANTUM ELECTRONICS; TUNGSTEN;

ELECTROMAGNETIC COMPATIBILITY;

EID: 84857446894     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEMC.2011.2167336     Document Type: Article

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