Reliability evaluation of CSP soldered joints based on FEM and Taguchi method

Computational Materials Science

Volumn 48, Issue 3, 2010, Pages 509-512

  Ye, Huan ^a   Xue, Songbai ^a   Zhang, Liang ^a   Ji, Feng ^a   Dai, Wei ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Chip scale package; Finite element method; Reliability; Taguchi method

Indexed keywords

CHIP THICKNESS; CREEP BEHAVIOUR; CREEP STRAIN; OPTIMAL PARAMETER SETTINGS; ORTHOGONAL ARRAY; RELIABILITY EVALUATION; SOLDER ALLOYS; SUBSTRATE THICKNESS; TAGUCHI; TEMPERATURE CYCLING; UPPER SURFACE;

COMPUTER OPERATING PROCEDURES; CREEP; RELIABILITY; SOLDERED JOINTS; TAGUCHI METHODS;

FINITE ELEMENT METHOD;

EID: 77950959711     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.commatsci.2010.02.014     Document Type: Article

References (15)

1. Mertol A. IEEE Transactions on Advanced Packaging 23 (2000) 266-276
2. Amagai M. Microelectronics Reliability 39 (1999) 463-477
3. Zhang B., Ding H., and Sheng X.J. Microelectronic Engineering 85 (2008) 610-620
4. Silberschmidt V.V. Computational Materials Science 26 (2003) 159-166
5. Hegde P., Ochana A.R., Whalley D.C., and Silberschmidt V.V. Computational Materials Science 43 (2008) 212-220
6. Sham M.L., Kim J.K., and Park J.H. Computational Materials Science 40 (2007) 81-89
7. Taguchi G. IEEE Transactions on Reliability 44 (1995) 225-229
8. Lai Y.S., and Wang T.H. Microelectronics and Reliability 47 (2007) 104-110
9. Lee W.W., Nguyen L.T., and Selvaduray G.S. Microelectronics Reliability 40 (2000) 231-244
10. Li X.Y., and Wang Z.S. Materials Processing Technology 183 (2007) 6-12
11. Tee T.Y., Ng H.S., and Zhong Z.W. Microelectronic Engineering 46 (2006) 2131-2138
12. Wang T.H., Wang C.C., Lai Y.S., Chang K.C., and Lee C.H. Microelectronic Engineering 85 (2008) 659-664
13. Lall P., Islam M.N., Singh N., Suhling J.C., and Darveaux R. IEEE Transactions on Components and Packaging Technologies 27 (2004) 585-593
14. Sheng Z., Xue S.B., Zhang L., and Gao L.L. Transactions of the China Welding Institution 29 (2008) 53-56
15. Lau J.H., and Lee W.R. IEEE Transactions on Electronics Packaging Manufacturing 25 (2002) 51-58