Application of the latency insertion method to electro-thermal circuit analysis

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011

Volumn , Issue , 2011, Pages 263-266

  Klokotov, D ^a   Schutt Aine J ^a   Beyene, W ^b   Mullen, D ^b   Li, M ^b   Schmitt, R ^b   Yang, L ^b  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b RAMBUS INC   (United States)

Author keywords

circuit simulation; electro thermal analysis; IR drop; latency insertion; power integrity

Indexed keywords

DESIGN STAGE; ELECTRO-THERMAL ANALYSIS; HIGH PERFORMANCE SYSTEMS; INTERCONNECT NETWORKS; IR DROP; LATENCY INSERTION; LATENCY INSERTION METHODS; OFF-CHIP; ON CHIPS; POWER INTEGRITY; SIMULATION TECHNIQUE; THERMAL PHENOMENA;

CHIP SCALE PACKAGES; CIRCUIT SIMULATION; THERMOANALYSIS; THREE DIMENSIONAL; VLSI CIRCUITS;

ELECTRIC NETWORK ANALYSIS;

EID: 84855393103     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEPS.2011.6100242     Document Type: Conference Paper

References (9)

1. José E. Schutt-Ainé, "Latency insertion method (LIM) for the fast transient simulation of large networks," IEEE Trans. Circuit Syst., vol. 48, Jan. 2001, pp. 81-89.
2. D. Klokotov, P. Goh, and J. E. Schutt-Ainé, "Latency Insertion Method (LIM) for DC Analysis of Power Supply Networks," IEEE Trans. Advanced Packaging, in press.
3. S. L. Lalgudi, M. Swaminathan, and Y. Kretchmer, "On-chip power-grid simulation using latency insertion method," IEEE Trans. Circuit Syst., vol. 55, no. 3, pp. 914-931, April 2008. (Pubitemid 351736384)
4. Y. Cheng, C. Tsai, C. Teng, and S. Kang, Electrothermal Analysis of VLSI Systems. Boston, MA: Kluwer, 2000.
5. Y. Zhong and M. D. F. Wong, "Thermal-aware IR drop analysis in large power grid," IEEE 9th International Symposium on Quality Electronic Design (ISQED), 2008, pp. 194-199
6. P. Li, L. T. Pileggi, M. Asheghi, and R. Chandra, "IC thermal simulation and modeling via efficient multigrid-based approaches," IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, vol. 25, no. 9, Sept 2006, pp. 1763-1776. (Pubitemid 44304105)
7. G. E. O. Davies, R. T. Fenner, and R. W. Lewis, NAFEMS Background To Benchmarks, NAFEMS, 1992, pp. 123-139.
8. C. C. Teng, Y. K. Cheng, E. Rosenbaum, and S. M. Kang, "iTEM: A temperature-dependent electromigration reliability diagnosis tool," IEEE Trans. Computer-Aided Design, vol. 16, pp. 882-893, Aug. 1997. (Pubitemid 127767702)
9. http://www.ansys.com/Products/Simulation+Technology/Fluid+Dynamics/ ANSYS+Icepak