Electrical-thermal co-simulation of 3D integrated systems with micro-fluidic cooling and joule heating effects

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 2, 2011, Pages 234-246

  Xie, Jianyong ^a   Swaminathan, Madhavan ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Finite volume method; fluidic cooling; Joule heating; power delivery network (PDN); thermal effect; through silicon via (TSV); voltage drop

Indexed keywords

HIGH POWER DENSITY; INTEGRATED PACKAGES; INTEGRATED SYSTEMS; JOULE HEATING EFFECT; POWER DELIVERY NETWORK (PDN); THROUGH-SILICON-VIA (TSV); VOLTAGE DISTRIBUTION; VOLTAGE DROP;

COOLING; ELECTRIC POWER TRANSMISSION; FINITE VOLUME METHOD; ITERATIVE METHODS; JOULE HEATING; PARTIAL DIFFERENTIAL EQUATIONS; THERMAL EFFECTS;

THREE DIMENSIONAL COMPUTER GRAPHICS;

EID: 83455214730     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2010.2101770     Document Type: Article

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