Thermal fracture of oxidized polydimethylsiloxane during soft lithography of nanopost arrays

Journal of Micromechanics and Microengineering

Volumn 21, Issue 5, 2011, Pages

  Tooley, Wes W ^a   Feghhi, Shirin ^a   Han, Sangyoon J ^a   Wang, Junlan ^a   Sniadecki, Nathan J ^a  

^a University of Washington   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BILAYER MATERIALS; CELLULAR FORCE; CIRCULAR TESTS; COEFFICIENT OF THERMAL EXPANSION; ELEVATED TEMPERATURE; FINITE ELEMENT ANALYSIS; NANOSCALE FEATURES; OXIDIZED SURFACES; PATTERN FIDELITY; POLYDIMETHYLSILOXANE PDMS; REPLICA MOLDING; REPRODUCIBILITIES; SOFT LITHOGRAPHY; SPATIAL RESOLUTION; SURFACE CRACKS; THERMAL FRACTURE;

CELLULAR ARRAYS; CRACKS; FINITE ELEMENT METHOD; FRACTURE; FRACTURE TOUGHNESS; LITHOGRAPHY; MICROCHANNELS; SILICONES; SURFACE DEFECTS; SURFACES;

THERMAL EXPANSION;

EID: 79955852412     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/21/5/054013     Document Type: Article

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