High-temperature silicon carbide and silicon on insulator based integrated power modules

5th IEEE Vehicle Power and Propulsion Conference, VPPC '09

Volumn , Issue , 2009, Pages 1032-1035

  Lostetter, A ^a   Hornberger, J ^a   Mcpherson, B ^a   Reese, B ^a   Shaw, R ^a   Schupbach, M ^a   Rowden, B ^b   Mantooth, A ^b   Balda, J ^b   Otsuka, T ^c   Okumura, K ^c   Miura, M ^c  

^a Arkansas Power Electronics International Inc   (United States)

^b University of Arkansas   (United States)

^c ROHM CO LTD   (Japan)

Author keywords

High temperature; SiC; Silicon carbide

Indexed keywords

AMBIENT TEMPERATURES; BUS VOLTAGE; GATE DRIVERS; HIGH TEMPERATURE; INTEGRATED POWER MODULE; JUNCTION TEMPERATURES; PEAK CURRENTS; POWER MODULE; POWER PACKAGE; SILICON ON INSULATOR;

ELECTRIC POWER SYSTEMS; PROPULSION;

SILICON CARBIDE;

EID: 72149112455     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/VPPC.2009.5289735     Document Type: Conference Paper

References (4)

1. Olejniczak, "Conversion of Electrical Energy from One Form to Another, and its Management through Multichip Module Structures", Patent # US 6, 462, 976 B1, United States Patent Office, Awarded October 8, 2002.
2. A. Lostetter, J. Hornberger, S. Magan Lal, K. Olejniczak, A. Mantooth, and Aicha Elshabini, "Development of Silicon-Carbide (SiC) Static-Induction-Transistor (SIT) Based Half-Bridge Power Converters, " Proceedings of the 2003 IMAPS Conference, Boston, MA, October 2003.
3. Lostetter, Olejniczak, Brown, and Elshabini, "The Utilization of Diamond and Diamond-Like-Carbon Substrates for High Performance Power Electronic Packaging Applications, " 2001 EPE Conference, Graz, Austria, August 2001.
4. B. McPherson, J. Hornberger, J. Bourne, A. Lostetter, R. Schubach, R. Shaw, B. Reese, B. Rowden, K. Okumura, T. Otsuka, A. Mantooth, S. Ang, J. Balda, "Packaging of High Temperature 50 kW SiC Motor Drive Modules for Hybrid-Electric Vehicles", IMAPS 2009, San Jose, CA, 2009.