A fixed-angle heat spreading model for dynamic thermal characterization of rear-cooled substrates

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2007, Pages 95-101

  Vermeersch, Bjorn ^a   De Mey, Gilbert ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

Dynamic model; Fixed angle; Heat spreading; Rear cooling; Substrate; Thermal impedance

Indexed keywords

ENERGY DISSIPATION; PARAMETER ESTIMATION; PROBLEM SOLVING; THERMAL EFFECTS;

FIXED ANGLES; HEAT SPREADING; THERMAL IMPEDANCE;

DYNAMIC MODELS;

EID: 34548073818     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/STHERM.2007.352393     Document Type: Conference Paper

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