Numerical investigation of heat transfer and pressure loss of double-layer microchannels for chip liquid cooling

ASME 2012 Heat Transfer Summer Conf. Collocated with the ASME 2012 Fluids Engineering Div. Summer Meeting and the ASME 2012 10th Int. Conf. on Nanochannels, Microchannels and Minichannels, HT 2012

Volumn 2, Issue , 2012, Pages 575-583

  Xie, Gongnan ^a   Liu, Yanquan ^b   Sunden, Bengt ^c   Zhang, Weihong ^a   Zhao, Jun ^d  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

^b XI'AN JIAOTONG UNIVERSITY   (China)

^c LUND UNIVERSITY   (Sweden)

^d HUAWEI TECHNOLOGIES CO LTD   (China)

Author keywords

Double layer; Liquid cooling; Microchannels; Numerical simulation

Indexed keywords

DOUBLE LAYERS; ELECTRONIC CHIPS; INTEGRATED ELECTRONICS; LAMINAR HEAT TRANSFER; LIQUID COOLING; LIQUID COOLING TECHNOLOGY; NUMERICAL INVESTIGATIONS; THERMAL CHARACTERISTICS;

COMPUTER SIMULATION; COOLING; COOLING SYSTEMS; INLET FLOW; LIQUIDS; PARALLEL FLOW;

MICROCHANNELS;

EID: 84892636379     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/HT2012-58021     Document Type: Conference Paper

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