Experimental study on laminar heat transfer in microchannel heat sink

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 379-386

  Lee, Poh Seng ^a   Ho, Juay Choy ^a   Xue, Hong ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b CALIFORNIA STATE POLYTECHNIC UNIVERSITY   (United States)

Author keywords

Developing heat transfer; Forced Convection; Laminar flow; Microchannel heat sink

Indexed keywords

CHANNEL FLOW; COOLING; FORCED CONVECTION; FRICTION; HEAT RESISTANCE; LAMINAR FLOW; NUSSELT NUMBER; PRESSURE DROP;

MICROCHANNEL HEAT SINK;

HEAT SINKS;

EID: 0036457913     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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