Modeling and optimization of multilayer minichannel heat sinks in single-phase flow

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 2, Issue , 2007, Pages 29-43

  Lei, Ning ^a   Ortega, Alfonso ^a   Vaidyanathan, Ranji ^b  

^a UNIVERSITY OF ARIZONA   (United States)

^b Advanced Ceramics Research Inc

Author keywords

[No Author keywords available]

Indexed keywords

HIGH POWER ELECTRONIC DEVICES; SINGLE-PHASE FLOW;

ASPECT RATIO; ELECTRONICS PACKAGING; FLOW RATE; HEAT RESISTANCE; HEAT TRANSFER; MULTILAYERS; PRESSURE DROP; SILICON CARBIDE;

HEAT SINKS;

EID: 40449135943     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33329     Document Type: Conference Paper

References (19)