Fast transient solution of a two-layered counter-flow microchannel heat sink

International Journal of Numerical Methods for Heat and Fluid Flow

Volumn 19, Issue 5, 2009, Pages 595-616

  Beh, S L ^a   Tio, K K ^a   Quadir, G A ^b   Seetharamu, K N ^c  

^a MULTIMEDIA UNIVERSITY   (Malaysia)

^b UNIVERSITY MALAYSIA PERLIS   (Malaysia)

^c PES UNIVERSITY   (India)

Author keywords

Cooling; Electronic equipment and components; Finite element analysis; Flow; Waveforms

Indexed keywords

ALTERNATIVE METHODS; ASYMPTOTIC WAVEFORM EVALUATION; BOTTOM WALL; COMPUTATIONAL TIME; CONVENTIONAL METHODS; COOLANT FLOW RATES; COOLING OF ELECTRONICS; DESIGN/METHODOLOGY/APPROACH; ELECTRONIC CIRCUITS; ELECTRONIC EQUIPMENT AND COMPONENTS; FAST TRANSIENTS; FINITE ELEMENT ANALYSIS; FLOW; FLUID VELOCITIES; HEAT TRANSFER PROBLEMS; LAYERED MICROCHANNELS; MAXIMUM TEMPERATURE; MECHANICAL SYSTEMS; MICRO CHANNEL HEAT SINKS; PHASE CHANGE; SIGNAL DELAYS; STEADY STATE; STEADY-STATE ANALYSIS; TRANSIENT CONDITIONS; WAVEFORMS;

AMPLIFIERS (ELECTRONIC); ASYMPTOTIC ANALYSIS; COOLING; ELECTRON TUBES; HEAT FLUX; HEAT SINKS; HEATING EQUIPMENT; MICROCHANNELS; OSCILLATORS (ELECTRONIC); TRANSIENT ANALYSIS;

FINITE ELEMENT METHOD;

EID: 70349208972     PISSN: 09615539     EISSN: None     Source Type: Journal    
DOI: 10.1108/09615530910963544     Document Type: Article

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