Thermal optimization of a microchannel heat sink with trapezoidal cross section

Journal of Electronic Packaging

Volumn 131, Issue 2, 2009, Pages 0210051-0210056

  Husain, Afzal ^a   Kim, Kwang Yong ^a  

^a Inha University   (South Korea)

Author keywords

Electronic cooling; Numerical simulation; Optimization; Surrogate method; Trapezoidal microchannel

Indexed keywords

ELECTRONIC COOLING; HEAT SINKS; LAMINAR FLOW; MICROCHANNELS; NAVIER STOKES EQUATIONS; NUMERICAL METHODS; QUADRATIC PROGRAMMING; SHAPE OPTIMIZATION; SURFACE PROPERTIES;

DESIGN POINTS; DESIGN VARIABLES; ELECTRONICS COOLING; MICRO CHANNEL HEAT SINKS; OBJECTIVE FUNCTIONS; OPTIMISATIONS; SHAPE-OPTIMIZATION; SURROGATE METHODS; THERMAL OPTIMIZATION; TRAPEZOIDAL MICROCHANNELS;

HEAT RESISTANCE;

EID: 77955181313     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.3103931     Document Type: Article

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