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Volumn , Issue , 2005, Pages 497-502

Interconnect patterning in a single step with multi-level nanoimprint lithography

Author keywords

[No Author keywords available]

Indexed keywords

DUAL DAMASCENE; ELECTRICAL TESTS; IMPRINTED MATERIALS; INTEGRATED CIRCUIT DEVICES; INTERCONNECT LEVELS; MASK FABRICATION; PROCESSING TIME; STEP-AND-FLASH IMPRINT LITHOGRAPHY;

EID: 84888356564     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (2)

References (9)
  • 8
    • 33745624126 scopus 로고    scopus 로고
    • Implementation of an imprint damascene process for interconnect fabrication
    • submitted June
    • Schmid, Gerard M. et. al, J. Vac. Sci. Tecnol. B. "Implementation of an imprint damascene process for interconnect fabrication", submitted June 2005.
    • (2005) J. Vac. Sci. Tecnol. B.
    • Schmid, G.M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.