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Volumn 143, Issue 9, 2012, Pages 1255-1261

Theoretical assessment of the Ni-Sn system

Author keywords

CALPHAD method; Ni Sn phase diagram; Theoretical assessment

Indexed keywords


EID: 84867182307     PISSN: 00269247     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00706-012-0778-5     Document Type: Article
Times cited : (30)

References (24)
  • 1
    • 84867185000 scopus 로고    scopus 로고
    • On the merits of transient liquid phase bonding as a substitute for soldering with High-Pb alloys
    • February 14-18, 2010, Seattle, USA
    • Kodentsov A (2010) On the merits of transient liquid phase bonding as a substitute for soldering with High-Pb alloys. Pre-sented at the 139th TMS Annual Meeting, February 14-18, 2010, Seattle, USA
    • (2010) Pre-sented at the 139th TMS Annual Meeting
    • Kodentsov, A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.