Pad conditioning and textural effects in chemical mechanical polishing

2005 Proceedings - 10th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2005

Volumn , Issue , 2005, Pages 33-42

  Lawing, A Scott ^a  

^a ROHM AND HAAS COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING(CMP); COMPETING EFFECTS; CUTTING CHARACTERISTICS; PAD CONDITIONER; PAD CONDITIONING; SHALLOW TRENCH ISOLATION; SURFACE ASPERITIES; SURFACE TEXTURES;

CHEMICAL MECHANICAL POLISHING;

EID: 84888241975     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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