A theory of pad conditioning for chemical-mechanical polishing

Journal of Engineering Mathematics

Volumn 50, Issue 1, 2004, Pages 1-24

  Borucki, Leonard J ^a   Witelski, Thomas ^b   Please, Colin ^c   Kramer, Peter R ^d   Schwendeman, Donald ^d  

^a MOTOROLA INC   (United States)

^b DUKE UNIVERSITY   (United States)

^c UNIVERSITY OF SOUTHAMPTON   (United Kingdom)

^d Rensselaer Polytechnic Institute   (United States)

Author keywords

Abrasive wear; Chemical mechanical polishing; Surface roughness

Indexed keywords

MATHEMATICAL MODELS; PROBABILITY DENSITY FUNCTION; SURFACE ROUGHNESS; WEAR OF MATERIALS;

ABRASIVE WEAR; FOAMED PADS; SOLID PADS; STATISTICAL MODELS;

CHEMICAL MECHANICAL POLISHING;

ABRASIVE WEAR; POLISHING; SURFACE ROUGHNESS;

EID: 15744365897     PISSN: 00220833     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:ENGI.0000042116.09084.00     Document Type: Article

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