Characterizing CMP pad conditioning using diamond abrasives

MICRO

Volumn 20, Issue 1, 2002, Pages 47-

  Dyer, Timothy ^a   Schlueter, Jim ^a  

^a SpeedFam IPEC ^*  (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33645538700     PISSN: 10810595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (2)

1. J Schlueter, "Trench Warfare: CMP and Shallow Trench Isolation, " Semiconductor International 22, no. 12 (1999): 123-130.
2. F Preston, Journal of the Society of Glass Technology 11, no. 214 (1927).