Pad conditioning in interlayer dielectric CMP

Solid State Technology

Volumn 40, Issue 6, 1997, Pages 185-191

  Ali, Iqbal ^a,b,d,e   Roy, Sudipto R ^a,c,f,g  

^a TEXAS INSTRUMENTS   (United States)

^b INTEL CORPORATION   (United States)

^c Submicron Technology   (Thailand)

^d UNIVERSITY OF ARIZONA   (United States)

^e ELECTROCHEMICAL SOCIETY   (United States)

^f UNIVERSITY OF CINCINNATI   (United States)

^g UNIVERSITY OF TEXAS AT ARLINGTON   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; DIELECTRIC MATERIALS; SLURRIES; DEGRADATION; GLAZES; SURFACE PHENOMENA;

CHEMICAL MECHANICAL PLANARIZATION (CMP); INTERLAYER DIELECTRICS; POLISHING PADS; CHEMICAL MECHANICAL PLANARIZATION (CMP) TECHNOLOGY; INTERLAYER DIELECTRIC;

INTEGRATED CIRCUIT MANUFACTURE; DIELECTRIC MATERIALS;

EID: 0001297610     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (16)

1. W.C. O'Mara, "Planarization by CMP: Forecasting the Future," Semiconductor International, pp. 140-146, July 1994.
2. C. Greenfield, SEMI Forecasts on CMP Growth, SEMI, Mountain View, CA, July 1994.
3. R. Jairath et al., "Chemical-mechanical Polishing: Process Manufacturabilty," Solid State Technology, pp. 71-77, July 1994.
4. P. Singer, "Chemical-mechanical Polishing: A new focus on Consumables," semiconductor International, pp. 48-52, February 1994.
5. S. Sivaram et al., "Planarizing Interlevel Dielectrics by Chemical-mechanical polishing," Solid State Technology, pp. 87-91, May 1992.
6. I. Ali, S. Roy, G. Shinn, "Chemical-mechanical Polishing of Interlayer Dielectric: A Review." Solid State Technology, pp. 63-70, October 1994.
7. Surface Tech Review, Rodel Corporation, Vol. 1, No. 10, p. 2, 1991.
8. J. Breivogel, L. Blanchard, M. Prince, US Patent No 5,216,843 June 1993.
9. I. Ali et al., "Investigating the Effect of Secondary Platen Pressure on Post-CMP Cleaning," Microcontamination, pp. 45-50, October 1994.
10. S. Roy et al., J. Electrochem. Soc., Vol. 142, No. 1, pp. 216-226, 1995.
11. D. Skoog, Principles of Instrumental Analysis, 3rd Ed., Saunders College Publishing, New York, p. 315, 1985.
12. D.Trojan, R. Howard Strasbaugh Inc., San Luis Obispo, CA, private communications, 1994.
13. S. Sivaram, Workshop on Chemical Mechanical Polishing for Planarization, Rensselaer Polytechnic Institute, Troy, NY, 1992.
14. S. Morimoto et al., Proc. Electrochem. Soc., p. 449, 1993.
15. Hawley's Condensed Chemical Dictionary, N.I. Sax, R.J. Lewis, Eds., Van Nostrand Reinhold Co., New York, p. 944, 1993.
16. C. Hepburn, Polyurethane Elastomers, Properties and Applications, p. 354, Applied Science Publishing, New York, 1982.