Communication: On the asymmetric growth behavior of intermetallic compound layers during extended reflow of Sn-Rich Alloy on Cu

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 43, Issue 10, 2012, Pages 3442-3446

  Yazzie, Kyle E ^a,b   Topliff, Jonathan ^a   Chawla, Nikhilesh ^a  

^a Arizona State University   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GROWTH BEHAVIOR; IMC LAYER; INTERMETALLIC COMPOUND LAYER; MECHANICAL BEHAVIOR; METALLIZATION LAYERS; SOLDER INTERCONNECTS; SOLDER JOINTS;

CERIUM ALLOYS; COPPER ALLOYS; INTERMETALLICS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 84867234276     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-012-1329-8     Document Type: Article

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