Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process

Microelectronics Reliability

Volumn 53, Issue 6, 2013, Pages 899-905

  Shang, P J ^a,b   Zhang, L ^a   Liu, Z Q ^a   Tan, J ^a   Shang, J K ^a,c  

^a INSTITUTE OF METAL RESEARCH   (China)

^b CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

^c United States of America   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY DISPERSIVE X-RAY SPECTROSCOPY; INTERFACIAL REGION; INTERMETALLIC COMPOUND GROWTHS; INTERMETALLIC GROWTH; KINETIC ANALYSIS; MORPHOLOGY CHANGES; SOLID-STATE AGING; SURFACE MICROSTRUCTURES;

INTERMETALLICS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; TIN; X RAY SPECTROSCOPY;

SOLDERING ALLOYS;

EID: 84879842978     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2013.02.013     Document Type: Article

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