SCOPUS 정보 검색 플랫폼

Materials Science and Engineering: A

Volumn 532, Issue , 2012, Pages 167-177

Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate

(3) Zou, H F a,b Zhang, Q K a Zhang, Z F a

a INSTITUTE OF METAL RESEARCH (China)

b CHINA AEROSPACE SCIENCE AND INDUSTRY CORPORATION (China)

Author keywords

Cu alloys; Interfacial embrittlement; Sn Bi solder; Void, Bi segregation

Indexed keywords

ALLOYING; BINARY ALLOYS; BISMUTH ALLOYS; COPPER ALLOYS; EMBRITTLEMENT; INTERFACES (MATERIALS); LEAD ALLOYS; LEAD-FREE SOLDERS; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; SUBSTRATES;

'CURRENT; ALLOYS JOINTS; CU ALLOY; CU SUBSTRATE; INTERFACIAL EMBRITTLEMENT; INTERFACIAL MICROSTRUCTURE; LONG-TERM AGING; MICROSTRUCTURES AND MECHANICAL PROPERTIES; SN-BI SOLDER; VOID, BI SEGREGATION;

TIN ALLOYS;

EID: 83855165657 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2011.10.078 Document Type: Article

Times cited : (59)

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