Optimum reactive ion etching of x-cut quartz using SF6 and Ar

Journal of Micromechanics and Microengineering

Volumn 23, Issue 11, 2013, Pages

  Minnick, M D ^a,b,c   Devenyi, G A ^a,b,c   Kleiman, R N ^a,b,c  

^a MCMASTER UNIVERSITY   (Canada)

^b MCMASTER UNIVERSITY   (Canada)

^c MCMASTER UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CONSTANT POWER; COUPLED PLASMA; ETCH RATES; MASK MATERIALS; PIT DENSITY; QUARTZ WAFERS; SHADOW MASK;

INDUCTIVELY COUPLED PLASMA; REACTIVE ION ETCHING; SULFUR HEXAFLUORIDE; SURFACE PROPERTIES; SURFACE ROUGHNESS;

QUARTZ;

EID: 84887031061     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/23/11/117002     Document Type: Article

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