An investigation into the characteristics of deep reactive ion etching of quartz using SU-8 as a mask

Journal of Micromechanics and Microengineering

Volumn 18, Issue 10, 2008, Pages

  Chen, H ^a   Fu, C ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ARGON; ETCHING; GAS MIXTURES; GASES; OXIDE MINERALS; PAPER; QUARTZ; SULFUR HEXAFLUORIDE; TABLE LOOKUP;

BIAS POWERS; CHAMBER GASSES; DEEP REACTIVE ION ETCHINGS; DRIE ETCHINGS; FLOW RATIOS; FUTURE RESEARCHES; ICP POWERS; MASK LAYERS; MASK MATERIALS; PROCESS PARAMETERS; REFERENCE MATERIALS; WALL PROFILES;

REACTIVE ION ETCHING;

EID: 58149344952     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/10/105001     Document Type: Article

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