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Volumn , Issue , 2010, Pages 108-113

Parylene HT®: A high temperature vapor phase polymer for electronics applications

Author keywords

Electronics; Parylene HT; Protection; Reliability and packaging

Indexed keywords

ACTIVE ELECTRONIC DEVICES; DEPOSITION CHARACTERISTICS; ELECTRONIC INDUSTRIES; ELECTRONICS APPLICATIONS; HIGH TEMPERATURE POLYMERS; HIGH-TEMPERATURE EXPOSURE; PARYLENES; PROTECTION;

EID: 84878232652     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (3)

References (11)
  • 3
    • 84876943591 scopus 로고    scopus 로고
    • Wafer level cavity package with via-through-pad interconnects
    • May
    • G. Gao, "Wafer Level Cavity Package with Via-through-pad Interconnects,", Global SMT & Packaging, May 2008.
    • (2008) Global SMT & Packaging
    • Gao, G.1
  • 5
    • 67650725884 scopus 로고    scopus 로고
    • Conformal polymer interconnect for high density chip scale packages
    • November-December
    • M. Robinson, J. leal, L. Andrews, "Conformal Polymer Interconnect for High Density Chip Scale Packages,", Advanced Microelectronics, November-December 2008.
    • (2008) Advanced Microelectronics
    • Robinson, M.1    Leal, J.2    Andrews, L.3
  • 6
    • 84878227253 scopus 로고    scopus 로고
    • Critical issues of wafer level chip scale package (WLCSP) with emphasis on cost analysis
    • November
    • J. H. Lau, "Critical issues of wafer level chip scale package (WLCSP) with emphasis on cost analysis," FlipChips Update, November 2000, page 20-23.
    • (2000) FlipChips Update , pp. 20-23
    • Lau, J.H.1
  • 7
    • 0001419040 scopus 로고
    • A new, general synthetic method for the preparation of linear poly-P-xylylenes
    • W.F. Gorham, "A New, General Synthetic Method for the Preparation of Linear Poly-P-Xylylenes,", J. Polym. Sci, Vol. 4, pp 3027-3039, 1966
    • (1966) J. Polym. Sci , vol.4 , pp. 3027-3039
    • Gorham, W.F.1
  • 9
    • 2342482330 scopus 로고
    • Careful PCB design enhances conformal coating performance
    • R. Olson, "Careful PCB Design Enhances Conformal Coating Performance,", Electronic Packaging and Production, pp 79, 1987
    • (1987) Electronic Packaging and Production , pp. 79
    • Olson, R.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.