-
1
-
-
84875810687
-
Depth of manual dismantling analysis: a cost-benefit approach
-
Achillas C., Aidonis D., Vlachokostas C., Karagiannidis A., Moussiopoulos N., Loulos V.D. Depth of manual dismantling analysis: a cost-benefit approach. Waste Manage 2013, 10.1016/j.wasman.2012.12.024.
-
(2013)
Waste Manage
-
-
Achillas, C.1
Aidonis, D.2
Vlachokostas, C.3
Karagiannidis, A.4
Moussiopoulos, N.5
Loulos, V.D.6
-
2
-
-
68849099899
-
Ionic-liquid materials for the electrochemical challenges of the future
-
Armand M., Endres F., MacFarlane D.R., Ohno H., Scrosati B. Ionic-liquid materials for the electrochemical challenges of the future. Nat. Mater. 2009, 8:621-629.
-
(2009)
Nat. Mater.
, vol.8
, pp. 621-629
-
-
Armand, M.1
Endres, F.2
MacFarlane, D.R.3
Ohno, H.4
Scrosati, B.5
-
3
-
-
79958070114
-
Thermal cracking of waste printed wiring boards for mechanical recycling by using residual steam preprocessing
-
Chen Y., Li J.H., Duan H.B., Wang Z.S. Thermal cracking of waste printed wiring boards for mechanical recycling by using residual steam preprocessing. Front. Environ. Sci. Eng. China 2011, 5:167-174.
-
(2011)
Front. Environ. Sci. Eng. China
, vol.5
, pp. 167-174
-
-
Chen, Y.1
Li, J.H.2
Duan, H.B.3
Wang, Z.S.4
-
4
-
-
34250970762
-
Thermodynamics and departures from Fourier's law of heat conduction
-
Coleman B.D., Mizel V.J. Thermodynamics and departures from Fourier's law of heat conduction. Arch. Ration. Mech. An. 1963, 13:245-261.
-
(1963)
Arch. Ration. Mech. An.
, vol.13
, pp. 245-261
-
-
Coleman, B.D.1
Mizel, V.J.2
-
5
-
-
78650523915
-
Examining the technology acceptance for dismantling of waste printed circuit boards in light of recycling and environmental concerns
-
Duan H.B., Hou K., Li J.H., Zhu X. Examining the technology acceptance for dismantling of waste printed circuit boards in light of recycling and environmental concerns. J. Environ. Manage. 2011, 92:392-399.
-
(2011)
J. Environ. Manage.
, vol.92
, pp. 392-399
-
-
Duan, H.B.1
Hou, K.2
Li, J.H.3
Zhu, X.4
-
6
-
-
79960965457
-
Characterization and inventory of PCDD/Fs and PBDD/Fs emissions from the incineration of waste printed circuit board
-
Duan H.B., Li J.H., Liu Y., Yamazaki N., Jiang W. Characterization and inventory of PCDD/Fs and PBDD/Fs emissions from the incineration of waste printed circuit board. Environ. Sci. Technol. 2011, 45:6322-6328.
-
(2011)
Environ. Sci. Technol.
, vol.45
, pp. 6322-6328
-
-
Duan, H.B.1
Li, J.H.2
Liu, Y.3
Yamazaki, N.4
Jiang, W.5
-
7
-
-
84863044409
-
An innovate method to recycle non-metallic materials from waste printed circuit board
-
(in Chinese)
-
Duan H.B., Li J.H., Wang S.T. An innovate method to recycle non-metallic materials from waste printed circuit board. China Environ. Sci. 2012, 32:100-104. (in Chinese).
-
(2012)
China Environ. Sci.
, vol.32
, pp. 100-104
-
-
Duan, H.B.1
Li, J.H.2
Wang, S.T.3
-
8
-
-
81355149379
-
Characterizing the emission of chlorinated/brominated dibenzo-p-dioxins and furans from low-temperature thermal processing of waste printed circuit board
-
Duan H.B., Li J.H., Liu Y., Yamazaki N., Jiang W. Characterizing the emission of chlorinated/brominated dibenzo-p-dioxins and furans from low-temperature thermal processing of waste printed circuit board. Environ. Pollut. 2012, 161:185-191.
-
(2012)
Environ. Pollut.
, vol.161
, pp. 185-191
-
-
Duan, H.B.1
Li, J.H.2
Liu, Y.3
Yamazaki, N.4
Jiang, W.5
-
9
-
-
48249152541
-
A plate produced by nonmetallic materials of pulverized waste printed circuit boards
-
Guo J., Cao B., Guo J.Y., Xu Z.M. A plate produced by nonmetallic materials of pulverized waste printed circuit boards. Environ. Sci. Technol. 2008, 42:5267-5271.
-
(2008)
Environ. Sci. Technol.
, vol.42
, pp. 5267-5271
-
-
Guo, J.1
Cao, B.2
Guo, J.Y.3
Xu, Z.M.4
-
10
-
-
75349112220
-
Wood plastic composite produced by nonmetals from pulverized waste printed circuit boards
-
Guo J., Tang Y., Xu Z.M. Wood plastic composite produced by nonmetals from pulverized waste printed circuit boards. Environ. Sci. Technol. 2009, 44:463-468.
-
(2009)
Environ. Sci. Technol.
, vol.44
, pp. 463-468
-
-
Guo, J.1
Tang, Y.2
Xu, Z.M.3
-
11
-
-
77952889895
-
Performance and thermal behavior of wood plastic composite produced by nonmetals of pulverized waste printed circuit boards
-
Guo J., Tang Y., Xu Z.M. Performance and thermal behavior of wood plastic composite produced by nonmetals of pulverized waste printed circuit boards. J. Hazard. Mater. 2010, 179:203-207.
-
(2010)
J. Hazard. Mater.
, vol.179
, pp. 203-207
-
-
Guo, J.1
Tang, Y.2
Xu, Z.M.3
-
12
-
-
67649795444
-
Recycling of non-metallic fractions from waste printed circuit boards: a review
-
Guo J.Y., Guo J., Xu Z.M. Recycling of non-metallic fractions from waste printed circuit boards: a review. J. Hazard. Mater. 2009, 168:567-590.
-
(2009)
J. Hazard. Mater.
, vol.168
, pp. 567-590
-
-
Guo, J.Y.1
Guo, J.2
Xu, Z.M.3
-
14
-
-
84885870885
-
Efficient and nondestructive dismantling of waste PCBs mounted with components
-
(in Chinese)
-
Hou K., Duan H.B., Jia W.F., Zhu W., Li J.H. Efficient and nondestructive dismantling of waste PCBs mounted with components. China Resour. Comprehen. Utiliz. 2008, 26:15-18. (in Chinese).
-
(2008)
China Resour. Comprehen. Utiliz.
, vol.26
, pp. 15-18
-
-
Hou, K.1
Duan, H.B.2
Jia, W.F.3
Zhu, W.4
Li, J.H.5
-
15
-
-
78651423911
-
Study on disassembling approaches of electronic components mounted on PCBs
-
Springer, London, S. Takata, Y. Umeda (Eds.)
-
Huang H., Pan J., Liu Z., Song S., Liu G. Study on disassembling approaches of electronic components mounted on PCBs. Advances in Life Cycle Engineering for Sustainable Manufacturing Businesses 2007, 263-266. Springer, London. S. Takata, Y. Umeda (Eds.).
-
(2007)
Advances in Life Cycle Engineering for Sustainable Manufacturing Businesses
, pp. 263-266
-
-
Huang, H.1
Pan, J.2
Liu, Z.3
Song, S.4
Liu, G.5
-
16
-
-
84868483404
-
Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB)
-
Lee J., Kim Y., Lee J.-c. Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB). J. Hazard. Mater. 2012, 387-394.
-
(2012)
J. Hazard. Mater.
, pp. 387-394
-
-
Lee, J.1
Kim, Y.2
Lee, J.-C.3
-
17
-
-
77249097449
-
Environmental friendly automatic line for recovering metal from waste printed circuit boards
-
Li J., Xu Z.M. Environmental friendly automatic line for recovering metal from waste printed circuit boards. Environ. Sci. Technol. 2010, 44:1418-1423.
-
(2010)
Environ. Sci. Technol.
, vol.44
, pp. 1418-1423
-
-
Li, J.1
Xu, Z.M.2
-
18
-
-
77955305836
-
Characteristic of low-temperature pyrolysis of printed circuit boards subjected to various atmospheres
-
Li J.H., Duan H.B., Yu K.L., Liu L.L., Wang S.T. Characteristic of low-temperature pyrolysis of printed circuit boards subjected to various atmospheres. Resour. Conserv. Recycle 2010, 54:810-815.
-
(2010)
Resour. Conserv. Recycle
, vol.54
, pp. 810-815
-
-
Li, J.H.1
Duan, H.B.2
Yu, K.L.3
Liu, L.L.4
Wang, S.T.5
-
19
-
-
84885871338
-
Interfacial and mechanical property analysis of waste printed circuit boards subject to thermal shock
-
Li J.H., Duan H.B., Yu K.L. Interfacial and mechanical property analysis of waste printed circuit boards subject to thermal shock. J. Air Waste Manage. 2010, 67:267-273.
-
(2010)
J. Air Waste Manage.
, vol.67
, pp. 267-273
-
-
Li, J.H.1
Duan, H.B.2
Yu, K.L.3
-
20
-
-
84885864025
-
-
A mechanical-physical process to recycle many types of electronic waste. CN 102699008 A (in Chinese).
-
Li, J.H., Zeng, X.L., Duan, H.B., Yuan, W.Y., Tan, Q.Y., Liu, L.L., 2012. A mechanical-physical process to recycle many types of electronic waste. CN 102699008 A (in Chinese).
-
(2012)
-
-
Li, J.H.1
Zeng, X.L.2
Duan, H.B.3
Yuan, W.Y.4
Tan, Q.Y.5
Liu, L.L.6
-
21
-
-
20344373701
-
Electronics without lead
-
Li Y., Moon K.-S., Wong C.P. Electronics without lead. Science 2005, 308:1419-1420.
-
(2005)
Science
, vol.308
, pp. 1419-1420
-
-
Li, Y.1
Moon, K.-S.2
Wong, C.P.3
-
22
-
-
33644780882
-
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
-
Li Y., Wong C.P. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications. Mater. Sci. Eng. 2006, R51:1-35.
-
(2006)
Mater. Sci. Eng.
, vol.R51
, pp. 1-35
-
-
Li, Y.1
Wong, C.P.2
-
23
-
-
84885837164
-
Tin solder
-
(in Chinese)
-
Qian S.F. Tin solder. Avi. Pre. Manuf. Tech. 1993, 29:19-23. (in Chinese).
-
(1993)
Avi. Pre. Manuf. Tech.
, vol.29
, pp. 19-23
-
-
Qian, S.F.1
-
24
-
-
0242363674
-
Ionic liquids-solvents of the future?
-
Rogers R.D., Seddon K.R. Ionic liquids-solvents of the future?. Science 2003, 302:792-793.
-
(2003)
Science
, vol.302
, pp. 792-793
-
-
Rogers, R.D.1
Seddon, K.R.2
-
26
-
-
47249086508
-
Leachability of printed wire boards containing leaded and lead-free solder
-
Townsend T., Musson S., Dubey B., Pearson B. Leachability of printed wire boards containing leaded and lead-free solder. J. Environ. Manage. 2008, 88:926-931.
-
(2008)
J. Environ. Manage.
, vol.88
, pp. 926-931
-
-
Townsend, T.1
Musson, S.2
Dubey, B.3
Pearson, B.4
-
27
-
-
78349304231
-
Urinary heavy metal levels and relevant factors among people exposed to e-waste dismantling
-
Wang H., Han M., Yang S., Chen Y., Liu Q., Ke S. Urinary heavy metal levels and relevant factors among people exposed to e-waste dismantling. Environ. Int. 2011, 37:80-85.
-
(2011)
Environ. Int.
, vol.37
, pp. 80-85
-
-
Wang, H.1
Han, M.2
Yang, S.3
Chen, Y.4
Liu, Q.5
Ke, S.6
-
28
-
-
44449091132
-
Elevated levels of urinary 8-hydroxy-2'-deoxyguanosine in male electrical and electronic equipment dismantling workers exposed to high concentrations of polychlorinated dibenzo-p-dioxins and dibenzofurans, polybrominated diphenyl ethers, and polychlorinated biphenyls
-
Wen S., Yang F.-X., Gong Y., Zhang X.-L., Hui Y., Li J.-G., Liu A.-L., Wu Y.-N., Lu W.-Q., Xu Y. Elevated levels of urinary 8-hydroxy-2'-deoxyguanosine in male electrical and electronic equipment dismantling workers exposed to high concentrations of polychlorinated dibenzo-p-dioxins and dibenzofurans, polybrominated diphenyl ethers, and polychlorinated biphenyls. Environ. Sci. Technol. 2008, 42:4202-4207.
-
(2008)
Environ. Sci. Technol.
, vol.42
, pp. 4202-4207
-
-
Wen, S.1
Yang, F.-X.2
Gong, Y.3
Zhang, X.-L.4
Hui, Y.5
Li, J.-G.6
Liu, A.-L.7
Wu, Y.-N.8
Lu, W.-Q.9
Xu, Y.10
-
29
-
-
48249150276
-
Electrostatic separation for recovering metals and nonmetals from waste printed circuit board: problems and improvements
-
Wu J., Li J., Xu Z.M. Electrostatic separation for recovering metals and nonmetals from waste printed circuit board: problems and improvements. Environ. Sci. Technol. 2008, 42:5272-5276.
-
(2008)
Environ. Sci. Technol.
, vol.42
, pp. 5272-5276
-
-
Wu, J.1
Li, J.2
Xu, Z.M.3
-
30
-
-
80054866119
-
Recycling of WEEE: characterization of spent printed circuit boards from mobile phones and computers
-
Yamane L.H., de Moraes V.T., Espinosa D.C.R., Tenório J.A.S. Recycling of WEEE: characterization of spent printed circuit boards from mobile phones and computers. Waste Manage. 2011, 31:2553-2558.
-
(2011)
Waste Manage.
, vol.31
, pp. 2553-2558
-
-
Yamane, L.H.1
de Moraes, V.T.2
Espinosa, D.C.R.3
Tenório, J.A.S.4
-
31
-
-
58149215689
-
Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill
-
Yoo J.M., Jeong J., Yoo K., Lee J.C., Kim W. Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill. Waste Manage. 2009, 29:1132-1137.
-
(2009)
Waste Manage.
, vol.29
, pp. 1132-1137
-
-
Yoo, J.M.1
Jeong, J.2
Yoo, K.3
Lee, J.C.4
Kim, W.5
-
32
-
-
84884912758
-
Current status and future perspective of waste printed circuit boards recycling
-
Zeng X.L., Zheng L.X., Xie H.H., Lu B., Xia K., Chao K.M., Li W.D., Yang J.X., Lin S., Li J.H. Current status and future perspective of waste printed circuit boards recycling. Proc. Environ. Sci. 2012, 16:590-597.
-
(2012)
Proc. Environ. Sci.
, vol.16
, pp. 590-597
-
-
Zeng, X.L.1
Zheng, L.X.2
Xie, H.H.3
Lu, B.4
Xia, K.5
Chao, K.M.6
Li, W.D.7
Yang, J.X.8
Lin, S.9
Li, J.H.10
-
33
-
-
84879978718
-
Perspective of electronic waste management in China based on a legislation comparison between China and the EU
-
Zeng X.L., Li J.H., Stevels A.L.N., Liu L.L. Perspective of electronic waste management in China based on a legislation comparison between China and the EU. J. Cleaner Prod. 2013, 51:80-87.
-
(2013)
J. Cleaner Prod.
, vol.51
, pp. 80-87
-
-
Zeng, X.L.1
Li, J.H.2
Stevels, A.L.N.3
Liu, L.L.4
-
34
-
-
78650521238
-
Research on disassembling electronic components on discarded PCBs with hot fluid
-
(in Chinese)
-
Zhong H., Song S., Liu Z., Zhang H. Research on disassembling electronic components on discarded PCBs with hot fluid. Mach. Des. Manuf. 2008, 4:101-103. (in Chinese).
-
(2008)
Mach. Des. Manuf.
, vol.4
, pp. 101-103
-
-
Zhong, H.1
Song, S.2
Liu, Z.3
Zhang, H.4
-
35
-
-
84860453880
-
Response to waste electrical and electronic equipments in China: legislation, recycling system, and advanced integrated process
-
Zhou L., Xu Z.M. Response to waste electrical and electronic equipments in China: legislation, recycling system, and advanced integrated process. Environ. Sci. Technol. 2012, 46:4713-4724.
-
(2012)
Environ. Sci. Technol.
, vol.46
, pp. 4713-4724
-
-
Zhou, L.1
Xu, Z.M.2
-
36
-
-
84866148483
-
Treatment of waste printed circuit board by green solvent using ionic liquid
-
Zhu P., Chen Y., Wang L.Y., Zhou M. Treatment of waste printed circuit board by green solvent using ionic liquid. Waste Manage. 2012, 32(10):1914-1918.
-
(2012)
Waste Manage.
, vol.32
, Issue.10
, pp. 1914-1918
-
-
Zhu, P.1
Chen, Y.2
Wang, L.Y.3
Zhou, M.4
-
37
-
-
84868100882
-
A new technology for recycling solder from waste printed circuit boards using ionic liquid
-
Zhu P., Chen Y., Wang L., Zhou M. A new technology for recycling solder from waste printed circuit boards using ionic liquid. Waste Manage. Res. 2012, 30:1222-1226.
-
(2012)
Waste Manage. Res.
, vol.30
, pp. 1222-1226
-
-
Zhu, P.1
Chen, Y.2
Wang, L.3
Zhou, M.4
|