A plate produced by nonmetallic materials of pulverized waste printed circuit boards

Environmental Science and Technology

Volumn 42, Issue 14, 2008, Pages 5267-5271

  Guo, Jie ^a   Cao, Bin ^a   Guo, Jiuyong ^a   Xu, Zhenming ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROMAGNETIC WAVE EMISSION; ELECTRONIC EQUIPMENT MANUFACTURE; FIBER OPTICS; GLASS FIBERS; GRAIN SIZE AND SHAPE; IMPACT STRENGTH; MECHANICAL PROPERTIES; METALS; MICROELECTRONICS; NONMETALLIC MATERIALS; PARTICLE SIZE; PLATES (STRUCTURAL COMPONENTS); POLLUTION; POLYCHLORINATED BIPHENYLS; PRECIOUS METALS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; RESINS; STRENGTH OF MATERIALS; WASTE INCINERATION;

BONDING AGENTS; CHARPY IMPACT STRENGTH; CIRCUIT BOARDS; FIBER BUNDLES; FLEXURAL STRENGTH; NOBLE METALS; SECONDARY POLLUTION;

MATERIALS PROPERTIES;

CALCIUM CARBONATE; COPPER; GLASS FIBER; NONMETAL; PIGMENT; POLYESTER; POLYSTYRENE; RESIN; TRANSFERRIN BINDING PROTEIN B; ZINC DERIVATIVE;

MECHANICAL PROPERTY; METAL; POLLUTION; RECYCLING;

ARTICLE; COMPOSITE MATERIAL; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; HARDNESS; MATERIALS; PARTICLE SIZE; POLLUTION; POLYMERIZATION; PRINTED CIRCUIT BOARD; RECYCLING; STRENGTH; WASTE;

CONSERVATION OF NATURAL RESOURCES; ELECTRONICS; MATERIALS TESTING; PARTICLE SIZE; REFUSE DISPOSAL; STRESS, MECHANICAL; TENSILE STRENGTH; WETTABILITY;

EID: 48249152541     PISSN: 0013936X     EISSN: None     Source Type: Journal    
DOI: 10.1021/es800825u     Document Type: Article

References (13)

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