Thermal cracking of waste printed wiring boards for mechanical recycling by using residual steam preprocessing

Frontiers of Environmental Science and Engineering in China

Volumn 5, Issue 2, 2011, Pages 167-174

  Chen, Yao ^a   Li, Jinhui ^a   Duan, Huabo ^a   Wang, Zhishi ^b  

^a TSINGHUA UNIVERSITY   (China)

^b UNIVERSITY OF MACAU   (Macao)

Author keywords

mechanical properties; residue steam; thermal crack; waste printed wiring board (PWB)

Indexed keywords

EID: 79958070114     PISSN: 16737415     EISSN: 16737520     Source Type: Journal    
DOI: 10.1007/s11783-011-0308-4     Document Type: Article

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