Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB)

Journal of Hazardous Materials

Volumn 241-242, Issue , 2012, Pages 387-394

  Lee, Jaeryeong ^a   Kim, Youngjin ^a   Lee, Jae chun ^b  

^a Kangwon National University   (South Korea)

^b Korea Institute of Geosceince and Mineral Resources   (South Korea)

Author keywords

Disassembling treatment; Electric electronic component; Physical separation; Printed circuit board; Separation efficiency

Indexed keywords

CONCENTRATION RATIO; CONTENT LEVEL; DENSE MEDIUM SEPARATION; DISASSEMBLING TREATMENT; DISTRIBUTION RATIO; ELECTRIC/ELECTRONIC COMPONENT; ELEMENTAL COMPOSITIONS; ENVIRONMENTAL PROBLEMS; HIGH SEPARATION EFFICIENCY; IC CHIPS; MAJOR ELEMENTS; PHYSICAL SEPARATION; PLATINUM GROUPS; RECYCLABILITY; RECYCLING PROCESS; SCARCE RESOURCES; SEPARATION EFFICIENCY; SEPARATION PROCESS; WEIGHT RATIOS;

EFFICIENCY; GOLD; GRINDING MILLS; MAGNETIC SEPARATION; ORGANIC POLLUTANTS; POLYCHLORINATED BIPHENYLS; PRINTED CIRCUIT BOARDS; RECYCLING;

SEPARATION;

CHEMICAL COMPOSITION; CONCENTRATION (COMPOSITION); ELECTRONIC EQUIPMENT; MAGNETIC PROPERTY; METAL; PCB; RECYCLING;

ARTICLE; CHEMICAL COMPOSITION; ELECTRONIC WASTE; ELECTRONICS; GRINDING; MAGNETIC SEPARATION; PRINTED CIRCUIT BOARD; SEPARATION TECHNIQUE; VIDEORECORDER; WASTE MANAGEMENT;

ELECTRICAL EQUIPMENT AND SUPPLIES; ELECTRONICS; MECHANICAL PROCESSES; RECYCLING; REFUSE DISPOSAL; REPUBLIC OF KOREA; WASTE PRODUCTS;

EID: 84868483404     PISSN: 03043894     EISSN: 18733336     Source Type: Journal    
DOI: 10.1016/j.jhazmat.2012.09.053     Document Type: Article

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