Leachability of printed wire boards containing leaded and lead-free solder

Journal of Environmental Management

Volumn 88, Issue 4, 2008, Pages 926-931

  Townsend, Timothy ^a   Musson, Stephen ^a   Dubey, Brajesh ^a   Pearson, Brian ^a  

^a University of Florida   (United States)

Author keywords

Alternative solder; Leaching; Lead; SPLP; TCLP; Toxicity

Indexed keywords

COPPER; LEACHING; LEAD-FREE SOLDERS; SILVER; SOLDERING; TIN; TIN COMPOUNDS; WASTE MANAGEMENT;

ALTERNATIVE SOLDER; LEACHABILITY; LEACHING; LEACHING TEST; LEAD; PRINTED WIRE BOARDS; SYNTHETIC PRECIPITATION LEACHING PROCEDURES; TIN-LEAD SOLDERS; TOXICITY CHARACTERISTICS; TOXICITY CHARACTERISTICS LEACHING PROCEDURES;

TOXICITY;

BISMUTH; COPPER; LEAD; SILVER; TIN;

ELECTRONIC EQUIPMENT; LEACHING; LEAD; SOLID WASTE; TOXICITY; WASTE MANAGEMENT;

ARTICLE; CONTROLLED STUDY; ELECTRONICS; ENVIRONMENTAL MANAGEMENT; HAZARDOUS WASTE; LANDFILL; LEACHING; PRINTED WIRE BOARD; SOIL POLLUTION; TOXICITY TESTING; WASTE DISPOSAL; WASTE MANAGEMENT;

EID: 47249086508     PISSN: 03014797     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jenvman.2007.04.017     Document Type: Article

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