A new technology for recycling solder from waste printed circuit boards using ionic liquid

Waste Management and Research

Volumn 30, Issue 11, 2012, Pages 1222-1226

  Zhu, Ping ^a   Chen, Yan ^a   Wang, Liang You ^a   Zhou, Ming ^b  

^a SHANGHAI UNIVERSITY   (China)

^b SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION   (China)

Author keywords

ionic liquid; melting; recycling; solder; solvent; Waste printed circuit boards

Indexed keywords

AFTER-TREATMENT; CROSS SECTION; ENVIRONMENTAL CONTAMINANT; ENVIRONMENTAL POLLUTIONS; HEATING MEDIUM; SECONDARY RESOURCES; TETRAFLUOROBORATES; WASTE PRINTED CIRCUIT BOARD;

BROMINE; EPOXY RESINS; MELTING; PRINTED CIRCUIT BOARDS; RECYCLING; SOLDERING ALLOYS; SOLVENTS;

IONIC LIQUIDS;

1 ETHYL 3 METHYLIMIZADOLIUM TETRAFLUOROBORATE; BROMINE; EPOXY RESIN; IMIDAZOLE DERIVATIVE; IONIC LIQUID; UNCLASSIFIED DRUG;

BORATE; HAZARDOUS WASTE; HEATING; POLLUTION EFFECT; RECYCLING; RESIN; SOLVENT; WASTE TREATMENT;

ARTICLE; COMPUTER; HEATING; POLLUTION; PRIORITY JOURNAL; RECYCLING; SOLID WASTE MANAGEMENT; TECHNOLOGY;

ELECTRONIC WASTE; ENVIRONMENTAL POLLUTION; EPOXY RESINS; HEATING; IMIDAZOLES; IONIC LIQUIDS; RECYCLING; REFUSE DISPOSAL; TIME FACTORS;

EID: 84868100882     PISSN: 0734242X     EISSN: 10963669     Source Type: Journal    
DOI: 10.1177/0734242X12457116     Document Type: Article

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