Electroless Deposition of Copper

Modern Electroplating: Fifth Edition

Volumn , Issue , 2011, Pages 433-446

  Paunovic, Milan ^a  

^a NONE

Author keywords

Cathodic partial reaction, electroactive species in partial cathodic reaction, complexed or noncomplexed copper ions; Electroless deposition of copper; Kinetics of electroless Cu deposition steady state electroless copper deposition at mixed potential Emp, preceded by the induction period

Indexed keywords

EID: 84885605641     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9780470602638.ch17     Document Type: Chapter

References (98)

1. C. Wagner and W. Traud, Z. Electrochem., 44, 391 (1938).
2. M. Paunovic, Plating, 55, 1161 (1968).
3. M. Saito, J. Met. Finish. Soc. Jpn., 17, 14 (1966).
4. F. M. Donahue, Oberflache-Surf., 13 (12), 301 (1972).
5. A. Molenaar, M. F. E. Holdrinet, and L. K. H. van Beek, Plating, 61, 238 (1974).
6. S. M. El-Raghy and A. A. Abo-Salama, J. Electrochem. Soc., 126, 171 (1979).
7. P. Bindra and J. Tweedie, J. Electrochem. Soc., 130, 1112 (1983).
8. A. Vashkialis and I. lachiayskene, Electrochemistry (Academy of Sciences USSR), 17, 1816 (1981).
9. L. N. Schoenberg, J. Electrochem. Soc., 118, 1571 (1971).
10. I. Ohno, S. Haruyama, Surf. Technol., 13, 1 (1981).
11. T. Hayashi, Met. Finish., 85 (6), 85 (1985).
12. J. W. Jacobs and J. M. G. Rikken, in Electroless Deposition of Metals and Alloys, M. Paunovic and I. Ohno, Eds., Proceedings, Vol. 12, Electrochemical Society, Pennington, NJ, 1988, p. 75.
13. J. W. Walker, Formaldehyde, Reinhold, New York, 1964.
14. J. Duffy, L. Pearson, and M. Paunovic, J. Electrochem. Soc., 130, 876 (1983).
15. M. Paunovic, J. Electrochem. Soc., 125, 173 (1978).
16. M. Paunovic, J. Electrochem. Soc., 124, 349 (1977).
17. E. Mattson and J. O'M. Bockris, Trans. Faradday Soc., 55, 1586 (1959).
18. J. L. Hall, R. F. Jones, C. E. Delchamp, C. W. McWillams, J. Am. Chem. Soc., 79, 3361 (1957).
19. D. A. Keyworth, Talanta, 2, 383 (1959).
20. N. Schoenberg, J. Electrochem. Soc., 119, 1491 (1972).
21. M. Paunovic and R. Arndt, J. Electrochem. Soc., 130, 794 (1983).
22. L. L. Duda, Plating Surf. Finish., 85 (7), 60 (1998).
23. M. Oita, M. Matsuoka, and C. Iwakura, Electrochim. Acta, 42, 1435 (1997).
24. D. Vitkavage and M. Paunovic, Plating Surf. Finish., 70 (4), 48 (1983).
25. M. Paunovic, J. Electrochem. Soc., 132, 1155 (1985).
26. M. Paunovic and D.Vitkavage, J. Electrochem. Soc., 126, 2282 (1979).
27. M. Paunovic, in Electrodeposition Technology, Theory and Practice, L. T. Romankiw and D. R. Turner, Eds., Proceedings, Vol. 17, Electrochemical Society, Pennington, NJ, 1987, p. 349.
28. I. Ohno, in Electroless Deposition of Metals and Alloys, M. Paunovic and I. Ohno, Eds., Proceedings, Vol. 12, Electrochemical Society, Pennington, NJ, 1988, p. 129.
29. A. J. Ricco and S. J. Martin, in Electroless Deposition of Metals and Alloys, M. Paunovic and I. Ohno, Eds., Proceedings, Vol. 12, Electrochemical Society, Pennington, NJ, 1988, p. 142.
30. S. Haruyama and I. Ohno, in Electroless Deposition of Metals and Alloys, M. Paunovic and I. Ohno, Eds., Proceedings, Vol. 12, Electrochemical Society, Pennington, NJ, 1988, p. 20.
31. H. Wiese and K. G. Weil, in Electroless Deposition of Metals and Alloys, M. Paunovic and I. Ohno, Eds., Proceedings, Vol. 12, Electrochemical Society, Pennington, NJ, 1988, p. 53.
32. M. Paunovic and C. H. Ting, in Electroless Deposition of Metals and Alloys, M. Paunovic and I. Ohno, Eds., Proceedings, Vol. 12, Electrochemical Society, Pennington, NJ, 1988, p. 170.
33. R. Sard, J. Electrochem. Soc., 117, 864 (1970).
34. M. Paunovic and C. Stack, in Electrocrystallization, R. Weil and R, G. Baradas, Eds., Proceedings, Vol. 6, Electrochemical Society, Pennington, NJ, 1981, p. 205.
35. S. Nakahara, Thin Solid Films, 45, 421 (1977).
36. S. Nakahara, Thin Solid Films, 64, 149 (1979).
37. A. Rantell, Treats. Inst. Met. Finish., 48, 191 (1970).
38. S. Nakahara and Y. Okinaka, Ada Metall., 31, 713 (1983).
39. M. Paunovic and R. Zeblisky, Plating Surf. Finish., 72 (2), 52 (1985).
40. J. Kim, S. H.Wess, D. Y. Jung, and R.W. Johnson, IBM J. Res. Develop., 8, 697 (1984).
41. H. J. Choi, R. Weil, Plating Surf. Finish., 68, (5), 110 (1981).
42. A. Danjanovic, M. Paunovic, T.H.V. Setty, and J. O'M. Bockris, Acta Metall., 13, 1092 (1965).
43. J. E. Graebner, Y. Okinaka, J. Appl. Phys., 60 (1), 36 (1986).
44. Y. Okinaka, and H. K. Straschil, J. Electrochem. Soc., 133, 2608 (1986).
45. S. Nakahara, Acta Metall., 36 (7), 1669 (1988).
46. J. J. Grunwald, L. Slominski, and A. Landau, Plating, 60, 1022 (1973).
47. Y. Okinaka, and S. Nakahara, J. Electrochem. Soc., 123, 475 (1976).
48. S. Nakahara, C. Y. Mak, and Y. Okinaka, J. Electrochem. Soc., 138, 1421 (1991).
49. H. Honma and S. Mizushima, J. Met. Finish. Soc. Jpn., 34, 290 (1983).
50. M.Yoshida, S. Nakahara, and H. Suto, J. Jpn. Inst. Met., 39, 414 (1975).
51. J. W. Patten, E. G. McClanahan, and J. W. Johnston, J. Appl. Phys., 42, 4371 (1971).
52. D. S. Stoychev, I. V. Tomov, and I. B. Vitanova, J. Appl. Electrochem., 15, 879 (1985).
53. I. V. Tomov, D. S. Stoychev, and I. B. Vitanova, J. Appl. Electrochem., 15, 887 (1985).
54. S. Nakahara, Y. Okinaka, and H. K. Straschil, J. Electrochem. Soc., 136, 1120 (1989).
55. M. Paunovic, Plating Surf. Finish., 70 (2), 62 (1983).
56. J. C. Patterson, M. O'Reilly, G. M. Crean, and J. Barrett, Microelectron. Eng., 33, 65 (1997).
57. S. Lopatin, Y. Shacham-Diamand, V. M. Dubin, P. K. Vasudev, B. Zhao, and J. Pellerin, in Electrochemically Deposited Thin Films, M. Paunovic and D. A. Scherson, Eds., Proceedings, Vol. 19, Electrochemical Society, Pennington, NJ, 1997, p. 271.
58. V. M. Dubin, Y. Shacham-Diamand, B. Zhao, P. K.Vasudev, and C. H. Ting, J. Electrochem. Soc., 144, 898 (1997).
59. H.-K. Kang, J. S. H. Cho, I. Asano, and S. S.Wong, VMIV Conf., June 9-10, 1992.
60. J. Tao, N.W. Cheung, C. Hu, H. -K. Kang, and S. S.Wong, IEEE Electron Device Lett., 13, 433 (1992).
61. M. Paunovic and M. Schlesinger, Fundamentals of Electrochemical Deposition, Wiley, New York, 1998, Ch. 3.
62. J. Bardeen, J. Appl. Phys., 11, 88 (1940).
63. P. L. Rossiter, The Electrical Resistivity of Metals and Alloys, Cambridge University Press, Cambridge, 1987.
64. M. Paunovic, L. A. Clevenger, J. Gupta, C. Cabral, Jr., and M. E. Harper, J. Electrochem. Soc., 140, 2690 (1993).
65. K.-N. Tu, J.W. Mayer, and L. C. Feldman, Electronic Thin Film Science, Macmillan, New York, 1992.
66. M. Ohring, The Materials Science of Thin Films, Academic, New York, 1992.
67. H.-K. Kang, J. S. H. Cho, I. Asano, and S. S.Wong, Proc. VLSI Multilevel Interconnection Conf. (VMIC), June 9-10, 1992, p. 337.
68. J. Tao, N.W. Cheung, C. Hu, H. K. Kang, and S. S.Wong, IEEE Electron Device Lett., 13(8), 433 (1992).
69. P. Pai, W. G. Oldham, C. H. Ting, and M. Paunovic, Abstract 481, Electrochemical Society Fall Meeting, Oct. 18-23, 1987.
70. Y. Shacham-Diamand, in Electrochemically Deposited Thin Films II, M. Paunovic, Ed., Proceedings, Vol. 31, Electrochemical Society, Pennington, NJ, 1995, p. 293.
71. P. C. Andricacos, Interface, 8, 32 (1999).
72. P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans, and H. Deligianni, IBM J. Res. Develop., 42, 567 (1998).
73. C. H. Ting and M. Paunovic, J. Electrochem. Soc., 136, 456 (1989).
74. C. H.Ting, M. Paunovic, P. Pai, and G. Chiu, Electrochem. Soc., 136, 462 (1989).
75. C. H. Ting and M. Paunovic, U.S. Patent 5, 169, 680 (1992).
76. J. P. Marton and M. Schlesinger, J. Electrochem. Soc., 115, 16 (1968).
77. C.H. deMinjer and P.F.G. v. d. Boom, J. Electrochem. Soc., 120, 1644 (1973).
78. M. Paunovic, J. Electrochem. Soc., 127, 441C (1980).
79. D. S. Gardner, J. Omuki, K. Kudoo, Y. Misawa, and Q. T. Vu, Thin Solid Films, 262, 104 (1955).
80. M. Yoshino, et al., J. Electrochem. Soc., 154(3) D122 (2007).
81. Youg-Soon Kim et al., J. Electrochem. Soc., 152(2) C89 (2005).
82. Y. Y. Sacham-Diamand, Solid-State Lett., 3, 279 (2000).
83. M. Paunovic and M. Schlesinger, Fundamentals of Electrochemical Deposition, 2nd ed., Wiley, Hoboken, NJ, 2006.
84. S. Zhong, et al., J. Electrochem. Soc., 152 (7) C446 (2005).
85. Z. Wang, et al., J. Electrochem. Soc., 152 (10) C684 (2005).
86. Z. Wang et al., J. Electrochem. Soc., 151 (12) C781 (2004).
87. S. Yagi, et al., J. Electrochem. Soc., 155 (6) D474 (2008).
88. M. Paunovic, J. Electrochem. Soc., 127 (2) 365 (1980).
89. M. Paunovic, J. Electrochem. Soc., 114, 472 (1967).
90. M. Paunovic and R. Oechslin, Plating, 58, 602 (1971).
91. S. R. Morrison, Electrochemistry at Semiconductor and Oxidized Metal Electrodes, Plenum, New York, 1980.
92. Y. Shacham-Diamand, B.-X. Sun, V. Yip, and R. Bielski, in Electrochemically Deposited Thin Films II, M. Paunovic, Ed., Proceedings, Vol. 31, Electrochemical Society, Pennington, NJ, 1995, p. 136.
93. H. Honma and T. Kobayashi, in Electrochemically Deposited Thin Films, M. Paunovic, I. Ohno, and Y. Miyoshi, Eds., Proceedings, Vol. 26, Electrochemical Society, Pennyngton, NJ, 1993, p. 344.
94. L. D. Burke, G. M. Bruton, and J. A. Collins, Electrochim. Acta, 44, 1467 (1998).
95. A. Hung, K. -M. Chen, J. Electrochem. Soc., 136, 72 (1987).
96. E. B. Saubestre, Proc. Am. Electropl. Soc., 46, 264 (1959).
97. W. Goldie, Plating, 51, 1069 (1964).
98. F. Pearlstein, U.S. Patent 3, 222, 195 (1965).