3D-MMC: A modular 3D multi-core architecture with efficient resource pooling

Proceedings -Design, Automation and Test in Europe, DATE

Volumn , Issue , 2013, Pages 1241-1246

  Zhang, Tiansheng ^a   Cevrero, Alessandro ^b   Beanato, Giulia ^b   Athanasopoulos, Panagiotis ^b   Coskun, Ayse K ^a   Leblebici, Yusuf ^b  

^a BOSTON UNIVERSITY   (United States)

^b EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION PROGRAMS; ELECTRONICS PACKAGING; MEMORY ARCHITECTURE; SOFTWARE DESIGN; TIME SHARING SYSTEMS;

APPLICATION EXECUTION; COMMUNICATION INFRASTRUCTURE; HARDWARE AND SOFTWARE DESIGNS; INTER-LAYER COMMUNICATION; MULTICORE ARCHITECTURES; PERFORMANCE BOTTLENECKS; PROPOSED ARCHITECTURES; TEMPERATURE CHARACTERISTIC;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 84885600747     PISSN: 15301591     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.7873/date.2013.257     Document Type: Conference Paper

References (18)

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