Centip3De: A 3930DMIPS/W configurable near-threshold 3D stacked system with 64 ARM Cortex-M3 cores

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn 55, Issue , 2012, Pages 190-191

  Fick, David ^a   Dreslinski, Ronald G ^a   Giridhar, Bharan ^a   Kim, Gyouho ^a   Seo, Sangwon ^a   Fojtik, Matthew ^a   Satpathy, Sudhir ^a   Lee, Yoonmyung ^a   Kim, Daeyeon ^a   Liu, Nurrachman ^a   Wieckowski, Michael ^a   Chen, Gregory ^a   Mudge, Trevor ^a   Sylvester, Dennis ^a   Blaauw, David ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; 3D DESIGN; 3D SYSTEMS; HIGH-PERFORMANCE IC; LOWER-POWER CONSUMPTION; POWER DENSITIES; STACKED SYSTEMS; SUPPLY VOLTAGES;

DESIGN; ENERGY EFFICIENCY;

THREE DIMENSIONAL;

EID: 84860678550     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSCC.2012.6176970     Document Type: Conference Paper

References (2)

1. B. Zhai, et al., "Energy efficient near-threshold chip multi-processing," IEEE International Symp. On Low-Power Electronics Design, pp. 32-37, 2007.
2. http://arm.com/products/processors/cortex-a/cortex-a9.php, ARM Ltd, 2011.