3D stacked microprocessor: Are we there yet?

IEEE Micro

Volumn 30, Issue 3, 2010, Pages 60-64

  Loh, Gabriel H ^a   Xie, Yuan ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b PENNSYLVANIA STATE UNIVERSITY   (United States)

Author keywords

Hardware; integrated circuits; microprocessor design

Indexed keywords

3-D INTEGRATED CIRCUIT; LARGE CITIES; LEVEL STRUCTURE; MANHATTANS; MICROPROCESSOR DESIGN; MICROPROCESSOR DESIGNS; NEW YORK CITY; REAL-WORLD; THREE DIMENSIONS;

DESIGN; MICROPROCESSOR CHIPS; OFFICE BUILDINGS; TALL BUILDINGS; THREE DIMENSIONAL;

INTEGRATED CIRCUITS;

EID: 77954592684     PISSN: 02721732     EISSN: None     Source Type: Journal    
DOI: 10.1109/MM.2010.45     Document Type: Conference Paper

References (0)