Two-million-pixel SOI diode uncooled IRFPA with 15μm pixel pitch

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 8353, Issue , 2012, Pages

  Fujisawa, Daisuke ^a   Maegawa, Tomohiro ^a   Ohta, Yasuaki ^a   Kosasayama, Yasuhiro ^a   Ohnakado, Takahiro ^a   Hata, Hisatoshi ^a   Ueno, Masashi ^a   Ohji, Hiroshi ^a   Sato, Ryota ^b   Katayama, Haruyoshi ^b   Imai, Tadashi ^b   Ueno, Munetaka ^b  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

^b JAPAN AEROSPACE EXPLORATION AGENCY   (Japan)

Author keywords

large format; SOI diode; stitching; Uncooled IRFPA

Indexed keywords

CHIP SCALE PACKAGES; INFRARED RADIATION; STITCHING (METAL JOINING);

CHIP SIZES; FRAME RATE; LARGE FORMAT; PIXEL PITCH; READ-OUT CIRCUIT; SOI DIODE; UNCOOLED; UNCOOLED IRFPA;

PIXELS;

EID: 84883807949     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.919520     Document Type: Conference Paper

References (12)

1. D. Takamuro, T. Maegawa, T. Sugino, Y. Kosasayama, T. Ohnakado, H. Hata, M. Ueno, H. Fukumoto, K. Ishida, H. Katayama, T. Imai and M. Ueno, "Development of new SOI diode structure for beyond 17μm pixel pitch SOI diode uncooled IRFPAs," Proc. SPIE Vol. 8012, 80121E, 2011.
2. T. Ishikawa, M. Ueno, K. Endo, Y. Nakaki, H. Hata, T. Sone, M. Kimata, and T. Ozeki, "Low-Cost 320 x 240 Uncooled IRFPA Using Conventional Silicon IC Process," Proc. SPIE, Vol. 3689, pp.556-564, 1999.
3. Y. Kosasayama, T. Sugino, Y. Nakaki, Y. Fujii, H. Inoue, H. Yagi, H. Hata, M. Ueno, M. Takeda, and M. Kimata, "Pixel scaling for SOI diode uncooled infrared focal plane arrays," Proc. SPIE, Vol. 5406, pp.504-511, 2004.
4. M. Ueno, Y. Kosasayama, T. Sugino, Y. Nakaki, Y. Fujii, H. Inoue, K. Kama, T. Seto, M. Takeda, and M. Kimata, "640 x 480 pixel uncooled infrared FPA with SOI diode detector," Proc. SPIE, Vol. 5783, pp.567-577, 2005.
5. H. Hata, Y. Nakaki, H. Inoue, Y. Kosasayama, Y. Ohta, H. Fukumoto, T. Seto, K. Kama, and M. Takeda, "Uncooled IRFPA with chip scale vacuum package," Proc. SPIE, Vol. 6206, 620619, 2006.
6. M. Kimata, M. Ueno, M. Takeda, and T. Seto, "SOI diode uncooled infrared focal plane arrays," Proc. SPIE, Vol. 6127, 61270X, 2006.
7. Y. Kosasayama, T. Sugino, Y. Nakaki, M. Ueno, and K. Kama, "High sensitive uncooled infrared FPA with SOI diode detectors," The Japan Society of Infrared Science and Technology, The 49th meeting, Feb., 2008 (in Japanese).
8. T. Ohnakado, M. Ueno, Y. Ohta, Y. Kosasayama, H. Hata, T. Sugino, T. Ohno, K. Kama, M. Tsugai, and H. Fukumoto, "Novel readout circuit architecture realizing TEC-less operation for SOI diode uncooled IRFPA," Proc. SPIE Vol. 7298, 72980V, 2009.
9. J.L. Tissot, A. Durand, Th. Garret, C. Minassian, P. Robert, S. Tinnes, and M. Vilain, "High performance uncooled amorphous silicon VGA IRFPA with 17μm pixel-pitch," Proc. SPIE, Vol. 7660, 76600T, 2010.
10. S. Kummer, "Low-power XGA Thermal Camera for Ground Applications," Proc. SPIE, Vol. 7660, 76600C, 2010.
11. C. Li, C.J. Han, G. D. Skidmore, and C. Hess, "DRS Uncooled VOx Infrared Detector Development and Production Status," Proc. SPIE, Vol. 7660, 76600V, 2010.
12. R. Blackwell, G. Franks, D. Lacroix, S. Hyland, and R. Murphy, "Small Pixel Uncooled Imaging FPAs and Applications," Proc. SPIE, Vol. 7660, 76600Y, 2010.