Uncooled IRFPA with chip scale vacuum package

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6206 I, Issue , 2006, Pages

  Hata, Hisatoshi ^a   Nakaki, Yoshiyuki ^a   Inoue, Hiromoto ^a   Kosasayama, Yasuhiro ^b   Ohta, Yasuaki ^b   Fukumoto, Hiroshi ^a   Seto, Toshiki ^a   Kama, Keisuke ^a   Takeda, Munehisa ^a   Kimata, Masafumi ^c  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

^b Kamakura Works ^*  (Japan)

^c RITSUMEIKAN UNIVERSITY   (Japan)

Author keywords

Chip scale vacuum package; SOI diode; Uncooled IRFPA

Indexed keywords

INTEGRATED CIRCUITS; SEALANTS; SEMICONDUCTOR DIODES; SILICON WAFERS; THIN FILMS; VACUUM;

CHIP SCALE VACUUM PACKAGE; SOI DIODES; THIN-FILM GETTERS; UNCOOLED IRFPA;

INFRARED DETECTORS;

EID: 33747678708     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.673072     Document Type: Conference Paper

References (7)

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