Ultra-short vertically aligned carbon nanofibers transfer and application as bonding material

Soldering and Surface Mount Technology

Volumn 25, Issue 4, 2013, Pages 242-250

  Chen, Si ^a  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

Flip chips; Interconnects; Intermetallic compounds; Microstructure; Shear strength

Indexed keywords

CONDUCTIVE ADHESIVE; DESIGN/METHODOLOGY/APPROACH; ELECTRICAL PERFORMANCE; FLIP-CHIP PACKAGES; FLIP-CHIPS; INTERCONNECT MATERIALS; MECHANICAL PERFORMANCE; VERTICALLY ALIGNED CARBON NANOFIBERS;

CONDUCTIVE MATERIALS; ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; INDIUM; INTERMETALLICS; MICROSTRUCTURE; OPTICAL INTERCONNECTS; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SOLDERED JOINTS; SOLDERING ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

CARBON NANOFIBERS;

EID: 84883428788     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/SSMT-10-2012-0025     Document Type: Article

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