Low-resistivity long-length horizontal carbon nanotube bundles for interconnect applications - Part ii: Characterization

IEEE Transactions on Electron Devices

Volumn 60, Issue 9, 2013, Pages 2870-2876

  Li, Hong ^a,b   Liu, Wei ^a   Cassell, Alan M ^c   Kreupl, Franz ^d   Banerjee, Kaustav ^a  

^a University of California   (United States)

^b MICRON TECHNOLOGY INC   (United States)

^c NASA AMES RESEARCH CENTER   (United States)

^d TECHNICAL UNIVERSITY OF MUNICH   (Germany)

Author keywords

Carbon nanotubes; characterization; horizontally aligned; interconnects; resistivity; self heating; temperature coefficient of resistance

Indexed keywords

ALIGNED CARBON NANOTUBES; CARBON NANOTUBE BUNDLE; HORIZONTALLY ALIGNED; INTERCONNECT APPLICATIONS; INTERCONNECT MODELING; SELF-HEATING; TEMPERATURE COEFFICIENT OF RESISTANCE; THERMAL CHARACTERIZATION;

CARBON NANOTUBES; ELECTRIC CONDUCTIVITY; OPTICAL INTERCONNECTS;

CHARACTERIZATION;

EID: 84883277693     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2013.2275258     Document Type: Article

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