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Volumn 21, Issue 17, 2013, Pages 19668-19674

P-side up AlGaInP-based light emitting diodes with dot-patterned GaAs contact layers

Author keywords

[No Author keywords available]

Indexed keywords

GALLIUM ALLOYS; GALLIUM ARSENIDE; LIGHT REFLECTION; LITHOGRAPHY; METALLORGANIC CHEMICAL VAPOR DEPOSITION; SEMICONDUCTING GALLIUM;

EID: 84883227011     PISSN: None     EISSN: 10944087     Source Type: Journal    
DOI: 10.1364/OE.21.019668     Document Type: Article
Times cited : (16)

References (16)
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  • 3
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  • 5
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    • White light emission of monolithic carbon-implanted InGaNGaN light-emitting diodes
    • C. T. Lee, U. Z. Yang, C. S. Lee, and P. S. Chen, "White light emission of monolithic carbon-implanted InGaNGaN light-emitting diodes," IEEE Photon. Technol. Lett. 18(19), 2029-2031 (2006).
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    • Lee, C.T.1    Yang, U.Z.2    Lee, C.S.3    Chen, P.S.4
  • 9
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    • AlGaInP/mirror/Si light-emitting diodes with vertical electrodes by wafer bonding
    • R. H. Horng, S. H. Huang, D. S. Wuu, and C. Y. Chiu, "AlGaInP/ mirror/Si light-emitting diodes with vertical electrodes by wafer bonding," Appl. Phys. Lett. 82(23), 4011-4013 (2003).
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    • Horng, R.H.1    Huang, S.H.2    Wuu, D.S.3    Chiu, C.Y.4
  • 10
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    • Wide angle distributed Bragg reflectors for 590 nm amber AlGaInP light-emitting diodes
    • S. W. Chiou, C. P. Lee, C. K. Huang, and C. W. Chen, "Wide angle distributed Bragg reflectors for 590 nm amber AlGaInP light-emitting diodes," J. Appl. Phys. 87(4), 2052-2054 (2000).
    • (2000) J. Appl. Phys. , vol.87 , Issue.4 , pp. 2052-2054
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  • 11
    • 3042751839 scopus 로고    scopus 로고
    • High-power AlGaInP light-emitting diodes with patterned copper substrates by electroplating
    • R. H. Horng, C. E. Lee, C. Y. Kung, S. H. Huang, and D. S. Wuu, "High-power AlGaInP light-emitting diodes with patterned copper substrates by electroplating," Jpn. J. Appl. Phys. 43(No. 4B), L576-L578 (2004).
    • (2004) Jpn. J. Appl. Phys. , vol.43 , Issue.4 B
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  • 12
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    • Water bonding of 50- mm-diameter mirror substrates to AlGaInP light-emitting diode wafers
    • R. H. Horng, D. S. Wuu, C. H. Seieh, W. C. Peng, M. F. Huang, S. J. Tsal, and J. S. Liu, "Water bonding of 50- mm-diameter mirror substrates to AlGaInP light-emitting diode wafers," J. Electron. Mater. 30(8), 907-910 (2001).
    • (2001) J. Electron. Mater. , vol.30 , Issue.8 , pp. 907-910
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  • 13
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  • 15
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    • Improved light extraction in AlGaInP-based LEDs using a roughened window layer
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  • 16
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.