SU-8-based rapid tooling for thermal roll embossing

DTIP 2011 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Volumn , Issue , 2011, Pages 279-283

  Metwally, Khaled ^a   Robert, Laurent ^a   Salut, Roland ^a   Khan Malek, Chantal ^a  

^a FEMTO ST INSTITUTE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

FABRICATION PROCESS; HOT-EMBOSSING; LITHOGRAPHIC PATTERNING; MASS PRODUCTION; RAPID TOOLING; REPLICATION PROCESS; RESEARCH LABS; ROLL EMBOSSING;

ELECTRON BEAM LITHOGRAPHY; PHOTOLITHOGRAPHY;

SILICON WAFERS;

EID: 84881032219     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)

1. T. Velten, H. Schuck, W. Haberer, and F. Bauerfeld, "Investigations on reel-to-reel hot embossing", Int. J. Adv. Manuf. Technol., vol.47, pp. 73-80, 2010.
2. L.P. Yeo, S.H. Ng, Z. F. Wang, H.M. Xia, Z. P. Wang, V.S. Thang, Z.W. Zhong, and N.F. de Rooij, "Investigation of hot roller embossing for microfluidic devices", J. Micromech. Microeng. 20 (1), pp.15017-15026, 2010.
3. H. Ahn and L. J. Guo, "Large-area roll-to-roll and roll-to-plate nanoimprint lithography: a step toward high-throughput application of continuous nanoimprinting", ACS Nano, Vol.3(8), pp. 2304-2310, 2010.
4. S. Miserere, J. Weber, B. De Lambert, JL. Viovy, L. Malaquin, "A toolbox for lamination-based fast prototyping of flexible monolithic COC chips". Proc. 1st European conference on Microfluidics-Bologna 10-12 Dec. 2008.
5. M. Focke, D. Kosse, C. Müller, H. Reinecke, R. Zengerle and F. von Stetten, "Lab-on-A-foil: microfluidics on thin and flexible films". Lab Chip, 10, pp 1365-1386, 2010.
6. H. Becker and U. Heim, "Hot embossing as a method for the fabrication of polymer high aspect ratio structures", Sensors and Actuators, 83, pp.130-135, 2000.
7. K. Metwally, S. Queste, L. Robert, R; Salut, C. Khan-Malek, "Hot roll embossing in thermoplastic foils using dry-etched silicon stamp and multiple passes", Microelectronic Engineering, in press 2011.
8. T. Koerner, L. Brown, R. Xie, R. D. Oleschuk, "Epoxy resins as stamps for hot embossing of microstructures and microfluidic channels", Sensors and Actuators B 107, pp. 632-639, 2005.
9. J. Steigert, S. Haeberle, T. Brenner, C. Müller, C. P. Steinert, P. Koltay, N. Gottschlich, H. Reinecke, J. Rühe, R. Zengerle and J. Ducrée, "Rapid prototyping of microfluidic chips in COC", J. Micromech. Microeng. 17, pp.333-341, 2007.
10. M. Svoboda, W. Schrott, Z. Slouka, M. Pribyl, D. Snita, "Plastic microfluidic systems made by imprinting against an epoxy stamp", Microelectronic Engineering 87, pp.1527-1530, 2010.
11. T. Velten, F. Bauerfeld, H. Schuck, and T. Knoll, "Low cost master fabrication for roll-to-roll hot embossing based on eboxy resin", 4M2010 Proc. 7th international conference on Multimaterial micro manufacture-Oyonnax, pp. 135-138, 2010.
12. A.L. Bogdanov, "Use of SU-8 Negative Photoresist for Optical Mask Manufacturing", Proc. SPIE-Advances in resist technology and processing XVII (Santa Clara CA), 3999, pp.1215-1225, 2000.
13. B. Bilenberg, S. Jacobsen, M.S. Schmidt, L.H.D. Skjolding, P. Shi, P. Bggild, J.O. Tegenfeldt, A. Kristensen, "High resolution 100 kV electron beam lithography in SU-8", Microelectron. Eng. 83, pp.1609-1612, 2006.
14. M. Gersborg-Hansen, L.H. Thamdrup, A. Mironov, A. Kristensen, "Combined electron beam and UV lithography in SU-8". Microelectronic Engineering 84, pp. 1058-1061, 2007.
15. J. Greener, W. Li, J. Ren, D. Voicu, V. Pakharenko, T. Tang and E. Kumacheva, "Rapid, cost-efficient fabrication of microfluidic reactors in thermoplastic polymers by combining photolithography and hot embossing". Lab Chip, 10, pp 522-524, 2010.
16. J.K. Chen, F.H. Ko, C.H. Chan, C.F. Huang and F.C. Chang, "Using imprinting technology to fabricate three-dimensional devices from moulds of thermosetting polymer patterns". Semicond. Sci. Technol. 21, pp.1213-1220, 2006.
17. M. B. Esch, S. Kapur, G. Irizarry and V. Genova, "Influence of master fabrication techniques on the characteristics of embossed microfluidic channels". Lab Chip. 3, pp.123-127, 2003.
18. M. Nordström, A. Johansson, E. S. Nogueron, B. Clausen, M. Calleja, A. Boisen, "Investigation of the bond strength between the photo-sensitive polymer SU-8 and gold". Microelectronic Engineering 78-79, pp.152-157, 2005.
19. S. J. Hong, S. Choi, Y. Choi, M. Allen, G.S. May, "Characterization of low-temperature SU-8 photoresist processing for MEMS applications". IEEE conference and workshop ASMC'04, pp.404-408, 2004.