Investigation of the bond strength between the photo-sensitive polymer SU-8 and gold

Microelectronic Engineering

Volumn 78-79, Issue 1-4, 2005, Pages 152-157

  Nordström, Maria ^a   Johansson, Alicia ^a   Noguerón, Encarnacion Sánchez ^a   Clausen, Bjarne ^a   Calleja, Montserrat ^a,b   Boisen, Anja ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b INSTITUTO DE MICROELECTRÓNICA DE MADRID   (Spain)

Author keywords

Adhesion; Metal; Pull test experiments; SU 8

Indexed keywords

ADHESION; CHEMICAL BONDS; CROSSLINKING; EVAPORATION; FABRICATION; GOLD; MICROELECTROMECHANICAL DEVICES; ULTRAVIOLET RADIATION;

ADHESION PROMOTERS; BOND STRENGTH; PULL-TEST EXPERIMENTS; SU-8;

POLYMERS;

EID: 14944339740     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.12.021     Document Type: Conference Paper

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