SCOPUS 정보 검색 플랫폼

Materials Transactions

Volumn 50, Issue 5, 2009, Pages 1135-1138

Wettability of low silver content lead-free solder alloy

(3) Budi Dharma, I Gusti Bagus a Abd Shukor, Mohd Hamdi a Ariga, Tadashi b

a UNIVERSITY OF MALAYA (Malaysia)

b TOKAI UNIVERSITY (Japan)

Author keywords

Lead free solder; Low silver content; Wettability

Indexed keywords

COPPER SUBSTRATES; LEAD FREE SOLDERS; LEAD-FREE SOLDER; LEAD-FREE SOLDER ALLOY; LOW SILVER CONTENT; SILVER CONTENT; SOLDER ALLOYS; TEST RESULTS; WETTABILITY; WETTING BALANCE; WETTING FORCE;

ALLOYS; BRAZING; CERIUM ALLOYS; CONTACT ANGLE; LEAD; SILVER; SOLDERING ALLOYS; SURFACE TENSION; TIN; WELDING; WETTING;

SILVER ALLOYS;

EID: 67650505619 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.M2009024 Document Type: Conference Paper

Times cited : (10)

References (14)

1
- 33947185255
- H. Wang, F. W. F. Gao, X. Ma and Y. Qian: J. Alloy. Compd. 433 (2007) 302-305.
- (2007) J. Alloy. Compd , vol.433 , pp. 302-305
- Wang, H.¹ Gao, F.W.F.² Ma, X.³ Qian, Y.⁴

2
- 0031251851
- L. N. Brush and R. N. Gruge: Mater. Sci. Eng. A 238 (1997) 176-171.
- (1997) Mater. Sci. Eng. A , vol.238 , pp. 176-171
- Brush, L.N.¹ Gruge, R.N.²

3
- 33846176947
- Y.-fu Yan, J.-hong Zhu, F.-xiao Chen, J.-guang He and D.-xin Yang: T. Nonferr. Metal. Soc. 16 (2006) 1116-1120.
- Y.-fu Yan, J.-hong Zhu, F.-xiao Chen, J.-guang He and D.-xin Yang: T. Nonferr. Metal. Soc. 16 (2006) 1116-1120.

4
- 0034946833
- H. S.-Hwan, K. K.-Soo and K. Suganuma: Mater. Trans. 42 (2001) 739-744.
- H. S.-Hwan, K. K.-Soo and K. Suganuma: Mater. Trans. 42 (2001) 739-744.

5
- 67650387019
- Met al. Handbook: Welding, brazing, and Soldering, 9th ed., 6 (American Society for Met al., Ohio, 1983).
- Met al. Handbook: Welding, brazing, and Soldering, 9th ed., 6 (American Society for Met al., Ohio, 1983).

6
- 0033747819
- M. Abtew and G. Selvaduray: Mater. Sci. Eng. A Rev. J. 27 (2000) 95-141.
- M. Abtew and G. Selvaduray: Mater. Sci. Eng. A Rev. J. 27 (2000) 95-141.

7
- 1142263920
- S. Nurmi, J. Sundelin, E. Ristolainen and T. Lepisto: Microelectron. Reliab. 44 (2004) 485-494.
- (2004) Microelectron. Reliab , vol.44 , pp. 485-494
- Nurmi, S.¹ Sundelin, J.² Ristolainen, E.³ Lepisto, T.⁴

8
- 0026852092
- Z. Mei and J. W. Morris: J. Electron. Mater. 21 (1992) 401-407.
- (1992) J. Electron. Mater , vol.21 , pp. 401-407
- Mei, Z.¹ Morris, J.W.²

9
- 0026882383
- Z. Mei and J. W. Morris: J. Electron. Mater. 21 (1992) 599.
- (1992) J. Electron. Mater , vol.21 , pp. 599
- Mei, Z.¹ Morris, J.W.²

10
- 67650368475
- J. Y. Park, C. S. Kang and J. P. Jung: J. Electron. Mater. 28 (1999).
- (1999) J. Electron. Mater , vol.28
- Park, J.Y.¹ Kang, C.S.² Jung, J.P.³

11
- 67650377870
- E. P. Lopez, P. T. Vianco and J. A. Rejent: J. Electron. Mater. 32 (2003).
- (2003) J. Electron. Mater , vol.32
- Lopez, E.P.¹ Vianco, P.T.² Rejent, J.A.³

12
- 67650380697
- C. M. L. Wu, C. M. T. Law, D. Q. Yu and L. Wang: J. Electron. Mater. 32 (2003).
- (2003) J. Electron. Mater , vol.32
- Wu, C.M.L.¹ Law, C.M.T.² Yu, D.Q.³ Wang, L.⁴

13
- 0011781503
- 3rd edition, American Welding Society, Florida
- Soldering Handbook, 3rd edition, (American Welding Society, Florida, 1999).
- (1999) Soldering Handbook

14
- 67650352870
- M. F. Arenas, M. He and V. L. Acoff: J. Electron. Mater. 35
- M. F. Arenas, M. He and V. L. Acoff: J. Electron. Mater. 35

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.