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Journal of Applied Physics

Volumn 108, Issue 8, 2010, Pages

Effects of Ag on the Kirkendall void formation of Sn-xAg/Cu solder joints

(2) Kim, Sunghwan a Yu, Jin a

a Korea Advanced Institute of Science and Technology (KAIST) (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CU UNDER BUMP METALLURGIES; KIRKENDALL VOID; SN-AG SOLDER; SOLDER JOINTS;

AUGER ELECTRON SPECTROSCOPY; SILVER; SODIUM; SOLDERING ALLOYS;

TIN;

EID: 78149443164 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.3488629 Document Type: Article

Times cited : (20)

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