메뉴 건너뛰기




Volumn 23, Issue 2, 2013, Pages

Thermal de-isolation of silicon microstructures in a plasma etching environment

Author keywords

[No Author keywords available]

Indexed keywords

FABRICATION ERRORS; HEAT SINKING; PLASMA ETCHING PROCESS; SILICON MICROSTRUCTURES; STANDARD DEVIATION; TEMPERATURE RISE; THEORETICAL AND EXPERIMENTAL; THIN METAL LAYERS;

EID: 84878152061     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/23/2/025026     Document Type: Article
Times cited : (12)

References (19)
  • 1
    • 77949986006 scopus 로고    scopus 로고
    • High isolation RF MEMS contact switch in V- and W-bands using two directional motions
    • 10.1049/el.2010.3153 0013-5194
    • Jang Y H, Lee Y S, Kim Y K and Kim J M 2010 High isolation RF MEMS contact switch in V- and W-bands using two directional motions Electron. Lett. 46 153-4
    • (2010) Electron. Lett. , vol.46 , Issue.2 , pp. 153-154
    • Jang, Y.H.1    Lee, Y.S.2    Kim, Y.K.3    Kim, J.M.4
  • 2
    • 10944247922 scopus 로고    scopus 로고
    • The SiOG-based single-crystalline silicon (SCS) RF MEMS switch with uniform characteristics
    • DOI 10.1109/JMEMS.2004.838365
    • Kim J M, Park J H, Baek C W and Kim Y K 2004 The SiOG-based single-crystalline silicon (SCS) RF MEMS switch with uniform characteristics J. Microelectromech. Syst. 13 1036-42 (Pubitemid 40009505)
    • (2004) Journal of Microelectromechanical Systems , vol.13 , Issue.6 , pp. 1036-1042
    • Kim, J.-M.1    Park, J.-H.2    Baek, C.-W.3    Kim, Y.-K.4
  • 3
    • 34948892097 scopus 로고    scopus 로고
    • Process development for CMOS-MEMS sensors with robust electrically isolated bulk silicon microstructures
    • DOI 10.1109/JMEMS.2007.906079
    • Qu H W and Xie H K 2007 Process development for CMOS-MEMS sensors with robust electrically isolated bulk silicon microstructures J. Microelectromech. Syst. 16 1152-61 (Pubitemid 47528012)
    • (2007) Journal of Microelectromechanical Systems , vol.16 , Issue.5 , pp. 1152-1161
    • Qu, H.1    Xie, H.2
  • 4
    • 0038548018 scopus 로고    scopus 로고
    • Corner-cube retroreflectors based on structure-assisted assembly for free-space optical communication
    • 10.1109/JMEMS.2003.809956 1057-7157
    • Zhou L, Kahn J M and Pister K S J 2003 Corner-cube retroreflectors based on structure-assisted assembly for free-space optical communication J. Microelectromech. Syst. 12 233-42
    • (2003) J. Microelectromech. Syst. , vol.12 , Issue.3 , pp. 233-242
    • Zhou, L.1    Kahn, J.M.2    Pister, K.S.J.3
  • 6
    • 14244258959 scopus 로고    scopus 로고
    • Prevention method of a notching caused by surface charging in silicon reactive ion etching
    • DOI 10.1088/0960-1317/15/2/016
    • Kim C H and Kim Y K 2005 Prevention method of a notching caused by surface charging in silicon reactive ion etching J. Micromech. Microeng. 15 358-61 (Pubitemid 40285594)
    • (2005) Journal of Micromechanics and Microengineering , vol.15 , Issue.2 , pp. 358-361
    • Kim, C.-H.1    Kim, Y.-K.2
  • 8
    • 71449085964 scopus 로고    scopus 로고
    • Stepped-etching for preserving critical dimensions in through-wafer deep reactive ion etching of thick silicon
    • Alper S E, Aydemir A and Akin T 2009 Stepped-etching for preserving critical dimensions in through-wafer deep reactive ion etching of thick silicon Transducers 2009 (Denver,) pp 1110-3
    • (2009) Transducers 2009 , pp. 1110-1113
    • Alper, S.E.1    Aydemir, A.2    Akin, T.3
  • 9
    • 0036544009 scopus 로고    scopus 로고
    • A novel high aspect ratio technology for MEMS fabrication using standard silicon wafers
    • DOI 10.1016/S0924-4247(02)00006-7, PII S0924424702000067
    • Bertz A, Kuchler M, Knofler R and Gessner T 2002 A novel high aspect ratio technology for MEMS fabrication using standard silicon wafers Sensors Actuators A 97-8 691-701 (Pubitemid 34758784)
    • (2002) Sensors and Actuators, A: Physical , vol.97-98 , pp. 691-701
    • Bertz, A.1    Kuchler, M.2    Knofler, R.3    Gessner, T.4
  • 10
    • 36549100931 scopus 로고
    • Low temperature reactive ion etching and microwave plasma etching of silicon
    • 10.1063/1.99382 0003-6951
    • Tachi S, Tsujimoto K and Okudaira S 1988 Low temperature reactive ion etching and microwave plasma etching of silicon Appl. Phys. Lett. 52 616-8
    • (1988) Appl. Phys. Lett. , vol.52 , Issue.8 , pp. 616-618
    • Tachi, S.1    Tsujimoto, K.2    Okudaira, S.3
  • 11
    • 0030564534 scopus 로고    scopus 로고
    • Low temperature etching of Si and PR in high density plasmas
    • DOI 10.1016/0169-4332(96)00342-X, PII S016943329600342X
    • Puech M and Maquin P 1996 Low temperature etching of Si and PR in high density plasmas Appl. Surf. Sci. 100 579-82 (Pubitemid 126357864)
    • (1996) Applied Surface Science , vol.100-101 , pp. 579-582
    • Puech, M.1    Maquin, Ph.2
  • 13
    • 77749321130 scopus 로고    scopus 로고
    • On the origin of selectivity and anisotropy loss during microstructure release etch
    • 0960-1317 035021
    • Gilgunn P J and Fedder G K 2010 On the origin of selectivity and anisotropy loss during microstructure release etch J. Micromech. Microeng. 20 035021
    • (2010) J. Micromech. Microeng. , vol.20 , Issue.3
    • Gilgunn, P.J.1    Fedder, G.K.2
  • 15
    • 84952618677 scopus 로고
    • Mechanisms of silicon etching in fluorine-and chlorine-containing plasmas
    • 10.1351/pac199062091709 0033-4545
    • Flamm D L 1990 Mechanisms of silicon etching in fluorine-and chlorine-containing plasmas Pure Appl. Chem. 62 1709-20
    • (1990) Pure Appl. Chem. , vol.62 , Issue.9 , pp. 1709-1720
    • Flamm, D.L.1
  • 17
    • 33947605764 scopus 로고    scopus 로고
    • MEMS technology for timing and frequency control
    • 10.1109/TUFFC.2007.240 0885-3010
    • Nguyen C T C 2007 MEMS technology for timing and frequency control IEEE Trans. Ultrason. Ferroelectr. Freq. Control 54 251-70
    • (2007) IEEE Trans. Ultrason. Ferroelectr. Freq. Control , vol.54 , Issue.2 , pp. 251-270
    • Nguyen, C.T.C.1
  • 18
    • 0035680070 scopus 로고    scopus 로고
    • RF MEMS switches and switch circuits
    • DOI 10.1109/6668.969936
    • Rebeiz G M and Muldavin J B 2001 RF MEMS switches and switch circuits IEEE Microw. Mag. 2 59-71 (Pubitemid 34051159)
    • (2001) IEEE Microwave Magazine , vol.2 , Issue.4 , pp. 59-71
    • Rebeiz, G.M.1    Muldavin, J.B.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.