Robust silicon deep etching without thermal isolation in large mass and long spring structures

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2012, Pages 317-320

  Lee, Yong Seok ^a   Jang, Yun Ho ^a   Kim, Jung Mu ^b   Kim, Yong Kweon ^a  

^a Seoul National University   (South Korea)

^b Chonbuk National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPLETE SOLUTIONS; COMPREHENSIVE ANALYSIS; DEEP ETCHING; FABRICATION METHOD; LARGE PROOF MASS; METAL LAYER; REFERENCE MODELS; TEMPERATURE RISE; THERMAL EQUIVALENT CIRCUIT; THERMAL ISOLATION; THIN METAL LAYERS;

COMPUTER SIMULATION; ETCHING; NATURAL FREQUENCIES;

MEMS;

EID: 84860450215     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2012.6170158     Document Type: Conference Paper

References (7)

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