An intelligent system for wafer bin map defect diagnosis: An empirical study for semiconductor manufacturing

Engineering Applications of Artificial Intelligence

Volumn 26, Issue 5-6, 2013, Pages 1479-1486

  Liu, Chiao Wen ^a   Chien, Chen Fu ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

ART 1 neural network; Cellular neural network (CNN); Semiconductor manufacturing; Spatial statistics test; Wafer bin map (WBM); Yield enhancement

Indexed keywords

ADAPTIVE RESONANCE THEORY; CLUSTERING APPROACH; CLUSTERING SOLUTIONS; SEMICONDUCTOR MANUFACTURING; SIMILARITY-MATCHING; SPATIAL STATISTICS; WAFER BIN MAP; YIELD ENHANCEMENT;

CELLULAR NEURAL NETWORKS; DEFECTS; GRAPHICAL USER INTERFACES; INDUSTRY; INTELLIGENT SYSTEMS; KNOWLEDGE BASED SYSTEMS; TECHNOLOGY TRANSFER;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 84876945059     PISSN: 09521976     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.engappai.2012.11.009     Document Type: Article

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